Camera with Image Sensor Shifting

ABSTRACT

Various embodiments include a camera voice coil motor (VCM) actuator configured to shift an image sensor along multiple axes. Some embodiments include a magnet and coil arrangement. Some embodiments include a position sensing arrangement. Some embodiments include a flexure arrangement. Some embodiments include a coil structure and coil carrier assembly.

This patent application is a continuation of U.S. patent applicationSer. No. 17/112,411, filed Dec. 4, 2020, which is a continuation of U.S.patent application Ser. No. 16/036,838, filed Jul. 16, 2018, now U.S.Pat. No. 10,863,094, which claims benefit of priority to U.S.provisional patent application No. 62/533,611, filed Jul. 17, 2017,which are herein incorporated by reference in their entirety.

BACKGROUND Technical Field

This disclosure relates generally to architecture for a camera withimage sensor shifting capabilities.

Description of the Related Art

The advent of small, mobile multipurpose devices such as smartphones andtablet or pad devices has resulted in a need for high-resolution, smallform factor cameras for integration in the devices. Some small formfactor cameras may incorporate optical image stabilization (OIS)mechanisms that may sense and react to external excitation/disturbanceby adjusting location of the optical lens on the X and/or Y axis in anattempt to compensate for unwanted motion of the lens. Some small formfactor cameras may incorporate an autofocus (AF) mechanism whereby theobject focal distance can be adjusted to focus an object plane in frontof the camera at an image plane to be captured by the image sensor. Insome such autofocus mechanisms, the optical lens is moved as a singlerigid body along the optical axis (referred to as the Z axis) of thecamera to refocus the camera.

BRIEF SUMMARY OF EMBODIMENTS

A camera may include a voice coil motor (VCM) actuator configured toshift an image sensor along multiple axes. A magnet and coil arrangementof the VCM actuator may include multiple magnets with a respectiveoptical image stabilization (OIS) coil proximate each magnet and anautofocus (AF) coil(s) above and/or below the magnets. A flexurearrangement may suspend a coil carrier assembly holding the OIS and AFcoils and a substrate holding the image sensor. Current may be driven ina controlled manner through the coils to move the coil carrier assemblyand substrate to shift the image sensor for OIS and/or AF. Someembodiments include a position sensing arrangement of one or moreposition sensors to provide position feedback for a control loopcontrolling the position of the image sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1D illustrate an example magnet and coil arrangement of a voicecoil motor (VCM) actuator for shifting an image sensor along multipleaxes, in accordance with some embodiments. FIG. 1A shows a perspectiveview of the magnet and coil arrangement. FIG. 1B shows a top view of themagnet and coil arrangement.

FIG. 1C shows a cross-sectional view of the magnet and coil arrangement.FIG. 1D shows another cross-sectional view of the magnet and coilarrangement.

FIGS. 2A and 2B illustrate an example magnetic layout of a VCM actuatorfor shifting an image sensor along multiple axes, in accordance withsome embodiments. FIG. 2A shows a top view of the magnetic layout. FIG.2B shows a cross-sectional view of the magnetic layout.

FIGS. 3A and 3B illustrate an example magnetic layout of a VCM actuatorfor shifting an image sensor along multiple axes, in accordance withsome embodiments. FIG. 3A shows a top view of the magnetic layout. FIG.3B shows a cross-sectional view of the magnetic layout.

FIGS. 4A and 4B illustrate an example magnetic layout of a VCM actuatorfor shifting an image sensor along multiple axes, in accordance withsome embodiments. FIG. 4A shows a top view of the magnetic layout. FIG.4B shows a cross-sectional view of the magnetic layout.

FIGS. 5A and 5B illustrate an example magnetic layout of a VCM actuatorfor shifting an image sensor along multiple axes, in accordance withsome embodiments. FIG. 5A shows a top view of the magnetic layout. FIG.5B shows a cross-sectional view of the magnetic layout.

FIGS. 6A and 6B illustrate an example magnetic layout of a VCM actuatorfor shifting an image sensor along multiple axes, in accordance withsome embodiments. FIG. 6A shows a top view of the magnetic layout. FIG.6B shows a cross-sectional view of the magnetic layout.

FIGS. 7A and 7B illustrate an example magnetic layout of a VCM actuatorfor shifting an image sensor along multiple axes, in accordance withsome embodiments. FIG. 7A shows a top view of the magnetic layout. FIG.7B shows a cross-sectional view of the magnetic layout.

FIGS. 8A-8C illustrate an example position sensing arrangement that maybe used to determine positioning of one or more components (e.g., of acamera that includes a VCM actuator for shifting an image sensor alongmultiple axes), in accordance with some embodiments. FIG. 8A shows aperspective view of the position sensing arrangement. FIG. 8B shows atop view of the position sensing arrangement. FIG. 8C shows across-sectional view of the position sensing arrangement.

FIGS. 9A and 9B illustrate an example flexure arrangement 900, inaccordance with some embodiments. FIG. 9A shows a perspective view ofthe flexure arrangement. FIG. 9B shows a cross-sectional view of theflexure arrangement in a camera that includes a VCM actuator forshifting an image sensor along multiple axes.

FIGS. 10A-10C illustrate example compliance provided by the exampleflexure arrangement of FIGS. 9A and 9B in response to different types ofmotion, in accordance with some embodiments. In various embodiments, theflexure arrangement may help guide motion of a substrate (to which animage sensor may be attached) and/or the image sensor in a controlledmanner.

FIGS. 11A and 11B illustrate perspective views of an example camera andexample locations within for placement of a viscoelastic material withinthe camera for damping purposes, in accordance with some embodiments. Invarious embodiments, the camera may include a VCM actuator for shiftingan image sensor along multiple axes), in accordance with someembodiments.

FIG. 12A illustrates a perspective view of an example coil structure andcoil carrier assembly, in accordance with some embodiments.

FIG. 12B illustrates a perspective view of an example coil carrier, inaccordance with some embodiments.

FIGS. 12C and 12D illustrate perspective views of an example coilstructure, in accordance with some embodiments.

FIG. 13 illustrates a block diagram of a portable multifunction devicethat may include a camera, in accordance with some embodiments.

FIG. 14 depicts a portable multifunction device that may include acamera, in accordance with some embodiments.

FIG. 15 illustrates an example computer system that may include acamera, in accordance with some embodiments.

This specification includes references to “one embodiment” or “anembodiment.” The appearances of the phrases “in one embodiment” or “inan embodiment” do not necessarily refer to the same embodiment.Particular features, structures, or characteristics may be combined inany suitable manner consistent with this disclosure.

“Comprising.” This term is open-ended. As used in the appended claims,this term does not foreclose additional structure or steps. Consider aclaim that recites: “An apparatus comprising one or more processorunits. . . . ” Such a claim does not foreclose the apparatus fromincluding additional components (e.g., a network interface unit,graphics circuitry, etc.).

“Configured To.” Various units, circuits, or other components may bedescribed or claimed as “configured to” perform a task or tasks. In suchcontexts, “configured to” is used to connote structure by indicatingthat the units/circuits/components include structure (e.g., circuitry)that performs those task or tasks during operation. As such, theunit/circuit/component can be said to be configured to perform the taskeven when the specified unit/circuit/component is not currentlyoperational (e.g., is not on). The units/circuits/components used withthe “configured to” language include hardware—for example, circuits,memory storing program instructions executable to implement theoperation, etc. Reciting that a unit/circuit/component is “configuredto” perform one or more tasks is expressly intended not to invoke 35U.S.C. § 112, sixth paragraph, for that unit/circuit/component.Additionally, “configured to” can include generic structure (e.g.,generic circuitry) that is manipulated by software and/or firmware(e.g., an FPGA or a general-purpose processor executing software) tooperate in manner that is capable of performing the task(s) at issue.“Configure to” may also include adapting a manufacturing process (e.g.,a semiconductor fabrication facility) to fabricate devices (e.g.,integrated circuits) that are adapted to implement or perform one ormore tasks.

“First,” “Second,” etc. As used herein, these terms are used as labelsfor nouns that they precede, and do not imply any type of ordering(e.g., spatial, temporal, logical, etc.). For example, a buffer circuitmay be described herein as performing write operations for “first” and“second” values. The terms “first” and “second” do not necessarily implythat the first value must be written before the second value.

“Based On.” As used herein, this term is used to describe one or morefactors that affect a determination. This term does not forecloseadditional factors that may affect a determination. That is, adetermination may be solely based on those factors or based, at least inpart, on those factors. Consider the phrase “determine A based on B.”While in this case, B is a factor that affects the determination of A,such a phrase does not foreclose the determination of A from also beingbased on C. In other instances, A may be determined based solely on B.

It will also be understood that, although the terms first, second, etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first contact could be termed asecond contact, and, similarly, a second contact could be termed a firstcontact, without departing from the intended scope. The first contactand the second contact are both contacts, but they are not the samecontact.

The terminology used in the description herein is for the purpose ofdescribing particular embodiments only and is not intended to belimiting. As used in the description and the appended claims, thesingular forms “a”, “an” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. It willalso be understood that the term “and/or” as used herein refers to andencompasses any and all possible combinations of one or more of theassociated listed items. It will be further understood that the terms“includes,” “including,” “comprises,” and/or “comprising,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

As used herein, the term “if” may be construed to mean “when” or “upon”or “in response to determining” or “in response to detecting,” dependingon the context. Similarly, the phrase “if it is determined” or “if [astated condition or event] is detected” may be construed to mean “upondetermining” or “in response to determining” or “upon detecting [thestated condition or event]” or “in response to detecting [the statedcondition or event],” depending on the context.

DETAILED DESCRIPTION

Some embodiments include camera equipment outfitted with controls,magnets, and voice coil motors to improve the effectiveness of aminiature actuation mechanism for a compact camera module. Morespecifically, in some embodiments, compact camera modules includeactuators to deliver functions such as autofocus (AF) and/or opticalimage stabilization (OIS). One approach to delivering a very compactactuator for OIS is to use a voice coil motor (VCM) arrangement, whichuses the selective flow of current through a coil to repel or attract acorresponding magnet, which in turn may produce relative movementbetween the coil and the magnet. In various embodiments, AF movement maycomprise movement of an image sensor along an optical axis. Furthermore,OIS movement may comprise lateral movement of the image sensor relativeto the optical axis. As used herein, the optical axis may be the path oflight as it impinges on the image sensor. The optical axis is generallyreferred to herein as the z-axis of a coordinate system (such that AFmovement may occur along the z-axis) and the x- and y-axes of thecoordinate system may represent a plane perpendicular to the opticalaxis along which the OIS movement may occur.

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings. In the following detaileddescription, numerous specific details are set forth in order to providea thorough understanding of the present disclosure. However, it will beapparent to one of ordinary skill in the art that some embodiments maybe practiced without these specific details. In other instances,well-known methods, procedures, components, circuits, and networks havenot been described in detail so as not to unnecessarily obscure aspectsof the embodiments.

FIGS. 1A-1D illustrate an example magnet and coil arrangement 100 of avoice coil motor (VCM) actuator for shifting an image sensor alongmultiple axes, in accordance with some embodiments. FIG. 1A shows aperspective view of the magnet and coil arrangement 100. FIG. 1B shows atop view of the magnet and coil arrangement 100. FIG. 1C shows across-sectional view of the magnet and coil arrangement 100. FIG. 1Dshows another cross-sectional view of the magnet and coil arrangement100. In some embodiments, the magnet and coil arrangement 100 mayinclude one or multiple features, components, and/or functionality ofembodiments described herein with reference to FIGS. 2A-15.

In various embodiments, the magnet and coil arrangement 100 may includeone or more magnets 102, one or more optical image stabilization (OIS)coils 104, and one or more autofocus (AF) coils 106. For example, asshown in FIGS. 1A and 1B, the magnet and coil arrangement 100 mayinclude four magnets 102 a-102 d (which may also be configured andreferred to as corner magnets), four OIS coils 104 a-104 d (which mayalso be configured and referred to as corner OIS coils or corner coils),and a single AF coil 106. The magnets 102 may be located proximate theOIS coils 104. For instance, each of the magnets 102 may be located to arespective side of a respective OIS coil 104. Specifically, thecorresponding magnet 102 for a given OIS coil is the magnet thatprovides the primary magnetic force to the OIS coil when a current isdriven through the coil (it may be desirable for the magnets and OIScoils to be spaced from each other so that magnet corresponding to afirst OIS coil has negligible impact on a second OIS coil correspondingto a different magnet). Furthermore, the magnets 102 may be locatedproximate the AF coil 106. For instance, the magnets 102 may be locatedabove the AF coil 106, e.g., as shown in FIG. 1A. The AF coil 106 may belocated proximate a plurality of magnets, and thus multiple magnets mayprovide magnetic forces for moving the AF coil 106 when current isdriven through the coil.

When the magnet and coil arrangement 100 is integrated into a camera asdescribed below, in some embodiments the AF coil 106 may be oriented ina plane perpendicular to an optical axis of the camera (e.g., opticalaxis 910 described herein with reference to FIG. 9B). The OIS coils 104may be positioned in respective planes each parallel to the opticalaxis. When the magnet and coil arrangement comprises two or more OIScoils (e.g., first, second, third, and fourth OIS coils 104 a-104 d),some OIS coils may be parallel to each other. For example, in theembodiment shown in FIG. 1B, the first and third OIS coils 104 a and 104c may be parallel to each other (i.e., the first OIS coil 104 a may bepositioned in a first plane that is parallel to a second plane in whichthe third OIS coil 104 c is positioned). Similarly, the second andfourth OIS coils 104 b and 104 d may be parallel to each other.

The AF coil 106 may be sized to surround the image sensor, although theAF coil 106 need not be in the same plane as the image sensor.Accordingly, the magnet and coil arrangement 100 may be positionedwithin a camera such that the AF coil 106 circumscribes a portion of thelight path of light imaged by the image sensor, which may allow the AFcoil 106 to provide autofocus actuation without limiting or otherwiseimpinging on the field of view of the camera.

As mentioned above, in some embodiments, the one or more magnets 102 maybe configured as corner magnets. In these variations the corner magnets102 may have respective polarity alignments (depicted by arrows 103 a-din FIGS. 1B and 1C) in respective directions that are angled (e.g., at45 degrees) relative to at least one side of a camera module. In variousembodiments, a camera module may include four sides that definerectangle when viewed from above, and the respective directions of therespective polarity alignments of the corner magnets 102 may be angledrelative to at least one of the four sides of the camera module. Thismay facilitate placement of the magnets 102 in the corners of the cameramodule (and in some instances one or more of the magnets 102 mayoptionally have a trapezoidal cross-section along the x-y plane whichmay further facilitate placement of the magnets 102 in the corners ofthe camera module). Additionally, or alternatively, the respectivedirections of the respective polarity alignments of the corner magnets102 may be coincident with respective planes that are orthogonal to theAF coil 106 and that intersect with respective corners of a cameramodule.

In some embodiments, opposing pairs of the OIS coils 104 may be used toprovide OIS movement in different directions. Typically the coils of anopposing pair of OIS coils may be positioned within respective parallelplanes. Additionally, in some variations each the coils of an opposingpair of OIS coils may further be centered along a line that isperpendicular to the parallel planes. For instance, two OIS coils (e.g.,the first and third OIS coils 104 a and 104 c depicted in FIGS. 1A and1B) may form a first opposing pair of OIS coils 104 that provide OISmovement in a first direction, e.g., as indicated by arrow B1. When themagnets associated with the first and third OIS coils 104 a and 104 c(e.g., the first and third magnets 102 a and 102 c) are configured ascorner magnets in a camera module, this first direction B1 may intersecttwo corners of the camera module. Two additional OIS coils (e.g., secondand fourth OIS coils 104 b and 104 d) may form a second opposing pair ofOIS coils 104 that provide OIS movement in a second direction, e.g., asindicated by arrow B2. In some instances, the first direction B1 may beorthogonal to the second direction B2. Again, when the magnetsassociated with the second and fourth OIS coils 104 b and 104 d (e.g.,the second and fourth magnets 102 b and 102 d) are configured as cornermagnets in a camera module, this first direction B2 may intersect twocorners of the camera module. In these embodiments, the device mayactivate one or both of the first opposing pair of OIS coils 104 (i.e.,by driving current through the coil or coils) to control movement alongdirection B1 and may activate one or both of the second opposing pairsof OIS coils 104 to control movement along direction B2. Collectively,the two sets of opposing pairs of OIS coils may provide two-dimensionalmovement in the x-y plane.

Some variations of the embodiments described here need not compriseopposing pairs of OIS coils, but there may be advantages to includingopposing pairs of OIS coils. For example, an opposing pair of OIS coilsmay provide a more linear force response as compared to a single OIScoil. Typically, when a driven coil moves away from the magnet, themagnetic force between the coil and magnet decreases and thus mayrequire a non-linear increase in driving current to continue to move thecoil away from the magnet. With an opposing pair of OIS coils, a firstcoil of a pair may push away from its respective magnet while the secondcoil of the pair may pull towards its respective magnet. While it maytake more current to provide the pushing force as the separation betweenthe first coil and its respective magnet increases, it will take lesscurrent to provide the pulling force as the separation between thesecond coil and its magnet decreases. Additionally, driving opposingpairs of OIS coils may help to cancel out torques that may otherwise beprovided to the coil arrangement by driving a single OIS coil.

In some examples, the OIS coils 104 and the AF coil 106 may be part of acommon coil structure 108, e.g., as described below with reference toFIGS. 12C and 12D. The coil structure may comprise a holding structure(e.g., a frame or the like) which may hold the OIS coils 104 and AF coilin a fixed relationship, such as discussed in more detail below. Whenthe magnet and coil arrangement 100 is integrated into a camera module,the arrangement may be integrated such that the coils (OIS coils 104 andAF coil 106) are moveable relative to the magnets 102. In someembodiments, the coil structure 108 may be movable to provide OIS and/orAF movement, while the magnets 102 may be stationary (e.g., held in afixed relationship to the camera module).

In some embodiments, the OIS coils 104 may be oriented orthogonal to theAF coil 106. For example, the OIS coils 104 may be vertically oriented(i.e., positioned in a plane that is oriented parallel to theoptical/z-axis), while the AF coil 106 may be horizontally oriented(i.e., positioned in a plane that is perpendicular to theoptical/z-axis).

FIG. 1D illustrates one embodiment of the polarity alignment of a magnet102 relative to an OIS coil 104 and AF coil 106. For example, FIG. 1Dmay illustrated the magnet and coils on the left side of FIG. 1C. In anembodiment in which the magnet and coil arrangement 100 is included in acamera, the magnet 102 may be attached to a non-moving structure of thecamera module. As illustrated, the north-south polarity alignment ofmagnet 102 is in a direction (as shown by arrow 103 in FIG. 1C)perpendicular to a plane in which OIS coil 104 lies and parallel to aplane in which AF coil 106 lies, with the north pole closer to OIS coil104 and the south pole close to an outer perimeter of the magnet andcoil arrangement 100. While the illustrated embodiment shows the northpole of magnet 102 facing OIS coil 104, in other embodiments, thepolarity may be reversed such that the south pole faces OIS magnet 104.In such an embodiment, for a given direction of movement, the current bybe driven in the opposite direction in OIS coil 104 and AF coil 106 thanfor the embodiment illustrated in FIG. 1D.

When a magnet and coil arrangement is incorporated into a camera module,the magnets and coils may have different orientations relative to eachother and relative to the rest of the camera module. In some instances,a magnet and coil arrangement may be configured to have a first AF coilthat is positioned below the magnets (relative to the direction ofincoming light), and one or more OIS coils that are each positionedbetween a corresponding magnet and the optical axis. FIGS. 2A and 2Billustrate one such example of a magnetic layout 200 of a voice coilmotor (VCM) actuator for shifting an image sensor along multiple axes,in accordance with some embodiments. Magnetic layout 200 is shownincorporated into a housing 210 of a camera module, although otherelements of the camera module (e.g., an image sensor, lens, or the like)are not shown here. FIG. 2A shows a top view of the magnetic layout 200.FIG. 2B shows a cross-sectional view of the magnetic layout 200 takenalong a diagonal of the camera module. In some embodiments, the magneticlayout 200 may include one or multiple features, components, and/orfunctionality of embodiments described herein with reference to FIGS.1A, 1B, and 3A-15.

In various embodiments, the magnetic layout 200 may include a pluralityof magnets 202 configured as corner magnets, one or more inside opticalimage stabilization (OIS) coils 204, and a bottom side autofocus (AF)coil 206, e.g., as shown in FIGS. 2A and 2B. For instance, the magneticlayout 200 may include four corner magnets 202 that are each locatedproximate a respective corner of a camera module. Each of the cornermagnets 202 may have a respective side that faces inward, e.g., in adirection opposite the respective corner of the camera module and/or ina direction toward a central portion of the camera module. The magneticlayout 200 may include a plurality of inside OIS coils 204 (e.g., fourOIS coils) that are each located proximate an inward-facing side of arespective corner magnets 202, such that the OIS coil is positionedbetween the respective corner magnet and the optical axis, and therespective corner magnet is positioned between the OIS coil and thehousing 210. The bottom side AF coil 206 may be located below the cornermagnets 202.

When an element is described here as being positioned “above” or “below”another element, this relative positioning is based on an orientationwhere the imaging side of the image sensor faces a top side of thecamera module and faces away from a bottom side of the camera module.Accordingly, if a first element is above a second element, the firstelement is closer to the top side of the camera module. For example, inthe embodiment shown in FIGS. 2A and 2B, magnets 202 may be closer to atop side 212 of the housing 210 and the AF coil 206 may be closer to thebottom side 214 of the housing 210, and thus the AF coil 206 isconsidered to be below the magnets 202. While FIGS. 2A and 2B show theAF coil 206 being a bottom side AF coil (i.e., positioned below themagnets 202), it should be appreciated that in other instances the AFcoil 206 may be a top side AF coil where the AF coil is positioned abovethe magnets 202.

As mentioned above with respect to FIGS. 1A-1D, in some examples, theinside OIS coils 204 and the bottom side AF coil 206 may be part of acommon coil structure (not shown) that may be movable to provide OISand/or AF movement, while the corner magnets 202 may be stationary.Furthermore, in some embodiments, the inside OIS coils 204 may beoriented orthogonal to the bottom side AF coil 206 (i.e., a given OIScoil may be positioned within a respective plane that is perpendicularto the plane in which the AF coil is positioned, such as discussed abovewith respect to FIGS. 1A-1D). For example, the inside OIS coils 204 maybe vertically oriented, while the bottom side AF coil 206 may behorizontally oriented. In some instances when an OIS coil is positionedproximate a corner magnet (such as shown in FIG. 2A), the plane in whichthe OIS coil is positioned may be perpendicular to a diagonal of thecamera module.

Example directions of current flow through the inside OIS coils 204 andthe bottom side AF coil 206 are indicated in FIG. 2B using crosses (Xs)and dots (•s). The crosses indicate current flowing “into the page,” andthe dots indicate current flowing “out of the page.” This conventioncarries over in all embodiments. Furthermore, hatching/shading as shownin the legend is used in FIGS. 2A and 2B to indicate example North andSouth pole orientations of the corner magnets 202.

In variations where the OIS coils 204 include one or more sets ofopposing OIS coil pairs (such as the two OIS coils depicted in FIG. 2B),the current direction through each coil is chosen to achieve a givendirection of movement of the OIS coils relative to the magnets. Forexample, in the cross-section shown in FIG. 2B, the magnets on oppositesides of the optical axis have reverse polarities (e.g., the north poleof each magnet faces the closest exterior corner of the housing 210). Inthese instances, current may be driven in the same direction in each ofthe opposing pair of OIS coils to create magnetic forces in a commondirection. For example, as current is driven through the left OIS coil204 in the direction shown in FIG. 2B, the left OIS coil 204 isattracted to the left magnet 202 (which would pull the OIS coil 204toward the left). As current is driven through the right OIS coil 204,the right OIS coil 204 is repelled by the right magnet 202, which wouldpush the right OIS coil 204 to the left. When the left and right OIScoils are connected to a common structure, this may result in leftwardmovement of the coil structure. The current direction may be reversed tomove the OIS coils to the right. It should be appreciated, both in thisembodiment and the other magnet and coil arrangement embodimentsdescribed here, that changing the North/South orientation of a givenmagnet or the relative positioning between an OIS coil and itsrespective magnet may require a change in current direction needed tomove the OIS coil in a certain direction.

While the magnetic layout 200 shown in FIGS. 2A and 2B depict a singleAF coil, it should be appreciated that in some instance a magnet andcoil arrangement may comprise a plurality of AF coils. FIGS. 3A and 3Billustrate an example magnetic layout 300 of a voice coil motor (VCM)actuator for shifting an image sensor along multiple axes, in accordancewith some embodiments. Magnetic layout 300 is shown incorporated into ahousing 310 of a camera module, although other elements of the cameramodule (e.g., an image sensor, lens, or the like) are not shown here.FIG. 3A shows a top view of the magnetic layout 300. FIG. 3B shows across-sectional view of the magnetic layout 300 taken along a diagonalof the camera module. In some embodiments, the magnetic layout 300 mayinclude one or multiple features, components, and/or functionality ofembodiments described herein with reference to FIGS. 1A-2B and 4A-15.

In various embodiments, the magnetic layout 300 may include a pluralitymagnets 302 configured as corner magnets, one or more inside opticalimage stabilization (OIS) coils 304, a first bottom side autofocus (AF)coil 306, and a second top side AF coil 308, e.g., as shown in FIGS. 3Aand 3B. For instance, the magnetic layout 300 may include four cornermagnets 302 that are each located proximate a respective corner of acamera module. Each of the corner magnets 302 may have a respective sidethat faces inward, e.g., in a direction opposite the respective cornerof the camera module and/or in a direction toward a central portion ofthe camera module. The magnetic layout 300 may include a plurality ofinside OIS coils 304 (e.g., four OIS coils) that are each locatedproximate an inward-facing side of a respective corner magnets 302, suchthat the OIS coil is positioned between the respective corner magnet andthe optical axis and the respective corner magnet is positioned betweenthe OIS coil and the housing 310. The bottom side AF coil 306 may belocated below the corner magnets 302. The top side AF coil 308 may belocated above the corner magnets 302.

In some examples, the inside OIS coils 304, the bottom side AF coil 306,and/or the top side AF coil 308 may be part of a common coil structure(not shown) that may be movable to provide OIS and/or AF movement, whilethe corner magnets 302 may be stationary. Furthermore, in someembodiments, the inside OIS coils 304 may be oriented orthogonal to thebottom side AF coil 306 and/or the top side AF coil 308. In other words,a given OIS coil may be positioned within a respective plane that isperpendicular to a plane in which the top side or bottom side AF coil ispositioned. When the bottom side AF coil 306 and top side AF coil 308are positioned in first and second parallel planes, a given OIS coil maybe positioned in a respective plane that is perpendicular to both thefirst and second parallel planes. For example, the inside OIS coils 304may be vertically oriented, while the bottom side AF coil 306 and/or thetop side AF coil 308 may be horizontally oriented.

Example directions of current flow through the inside OIS coils 304, thebottom side AF coil 306, and the top side AF coil 308 are indicated inFIG. 3B. In some embodiments, current may flow through the bottom sideAF coil 306 and the top side AF coil 308 in the same direction, whichmay promote forces in a common direction between the bottom side AF coil306 and magnets 302 and between the top side AF coil 308 and magnets302. Furthermore, hatching/shading as shown in the legend is used inFIGS. 3A and 3B to indicate example North and South pole orientations ofthe corner magnets 302.

While the magnets discussed above with respect to FIGS. 2A, 2B, 3A, and3C are configured as corner magnets, in other instances one or moremagnets may be configured as side magnets. FIGS. 4A and 4B illustrate anexample magnetic layout 400 of a voice coil motor (VCM) actuator forshifting an image sensor along multiple axes, in accordance with someembodiments. Magnetic layout 400 is shown incorporated into a housing410 of a camera module, although other elements of the camera module(e.g., an image sensor, lens, or the like) are not shown here. FIG. 4Ashows a top view of the magnetic layout 400. FIG. 4B shows across-sectional view of the magnetic layout 400 taken along a directionparallel to a side of the camera module. In some embodiments, themagnetic layout 400 may include one or multiple features, components,and/or functionality of embodiments described herein with reference toFIGS. 1A-3B and 5A-15.

In various embodiments, the magnetic layout 400 may include a pluralityof magnets 402 configured as side magnets, one or more inside opticalimage stabilization (OIS) coils 404, and a bottom side autofocus (AF)coil 406, e.g., as shown in FIGS. 4A and 4B. For instance, the magneticlayout 400 may include four side magnets 402 that are each locatedproximate a respective side of a camera module. Each of the side magnets402 may have a respective side that faces inward, e.g., in a directionopposite the respective side of the camera module and/or in a directiontoward a central portion of the camera module. In some embodiments theinward-facing side of a side magnet may be parallel to the respectiveside of the camera module. In some embodiments, the side magnets 402 mayhave respective polarity alignments in respective directions that areorthogonal to at least one side of the camera module. In variousembodiments, the camera module may include four sides that definerectangle when viewed from above, and the respective directions of therespective polarity alignments of the side magnets 402 may be angledrelative to at least one of the four sides of the camera module.

The magnetic layout 400 may include a plurality of inside OIS coils 404(e.g., four inside OIS coils 404) that are each located proximate arespective inward-facing side of the side magnets 402, such that theinside OIS coil is positioned between the respective side magnet and theoptical axis and the respective side magnet is positioned between theOIS coil and the housing 410. The bottom side AF coil 406 may be locatedbelow the side magnets 402. While FIGS. 4A and 4B show the AF coil 406being a bottom side AF coil (i.e., positioned below the magnets 402), itshould be appreciated that in other instances the AF coil 406 may be atop side AF coil where the AF coil is positioned above the magnets 402.

In some examples, the inside OIS coils 404 and the bottom side AF coil406 may be part of a common coil structure (not shown) that may bemovable to provide OIS and/or AF movement, while the side magnets 402may be stationary. Furthermore, in some embodiments, the inside OIScoils 404 may be oriented orthogonal to the bottom side AF coil 406(i.e., a given OIS coil may be positioned within a respective plane thatis perpendicular to the plane in which the AF coil is positioned, suchas discussed above with respect to FIGS. 1A-1D). For example, the insideOIS coils 404 may be vertically oriented, while the bottom side AF coil406 may be horizontally oriented. In some instances when an OIS coil ispositioned proximate a side magnet (such as shown in FIG. 4A), the planein which the OIS coil is positioned may be parallel to a respective sideof the camera module.

Example directions of current flow through the inside OIS coils 404 andthe bottom side AF coil 406 are indicated in FIG. 4B. Furthermore,hatching/shading as shown in the legend is used in FIGS. 4A and 4B toindicate example North and South pole orientations of the side magnets402.

FIGS. 5A and 5B illustrate another example magnetic layout 500 of avoice coil motor (VCM) actuator for shifting an image sensor alongmultiple axes, in accordance with some embodiments. Magnetic layout 500is shown incorporated into a housing 510 of a camera module, althoughother elements of the camera module (e.g., an image sensor, lens, or thelike) are not shown here. FIG. 5A shows a top view of the magneticlayout 500. FIG. 5B shows a cross-sectional view of the magnetic layout500 taken along a direction parallel to a side of the camera module. Insome embodiments, the magnetic layout 500 may include one or multiplefeatures, components, and/or functionality of embodiments describedherein with reference to FIGS. 1A-4B and 6A-15.

In various embodiments, the magnetic layout 500 may include a pluralityof magnets 502 configured as side magnets, one or more inside opticalimage stabilization (OIS) coils 504, a bottom side autofocus (AF) coil506, and a top side AF coil 508, e.g., as shown in FIGS. 5A and 5B. Forinstance, the magnetic layout 500 may include four side magnets 502 thatare each located proximate a respective side of a camera module. Each ofthe side magnets 502 may have a respective side that faces inward, e.g.,in a direction opposite the respective side of the camera module and/orin a direction toward a central portion of the camera module. In someembodiments the inward-facing side of a side magnet may be parallel tothe respective side of the camera module. The magnetic layout 500 mayinclude a plurality of inside OIS coils 504 (e.g., four) that are eachlocated proximate a respective inward-facing side of the side magnets502, such that the inside OIS coil is positioned between the respectiveside magnet and the optical axis and the respective side magnet ispositioned between the OIS coil and the housing 510. The bottom side AFcoil 506 may be located below the side magnets 502. The top side AF coil508 may be located above the side magnets 502.

In some examples, the inside OIS coils 504, the bottom side AF coil 506,and/or the top side AF coil 508 may be part of a common coil structure(not shown) that may be movable to provide OIS and/or AF movement, whilethe side magnets 502 may be stationary. Furthermore, in someembodiments, the inside OIS coils 504 may be oriented orthogonal to thebottom side AF coil 506 and/or the top side AF coil 508. In other words,a given OIS coil may be positioned within a respective plane that isperpendicular to a plane in which the top side or bottom side AF coil ispositioned. When the bottom side AF coil 506 and top side AF coil 508are positioned in first and second parallel planes, a given OIS coil maybe positioned in a respective plane that is perpendicular to both thefirst and second parallel planes. For example, the inside OIS coils 504may be vertically oriented, while the bottom side AF coil 506 and/or thetop side AF coil 508 may be horizontally oriented. In some instanceswhen an OIS coil is positioned proximate a side magnet (such as shown inFIG. 5A), the plane in which the OIS coil is positioned may be parallelto a respective side of the camera module.

Example directions of current flow through the inside OIS coils 504, thebottom side AF coil 506, and the top side AF coil 508 are indicated inFIG. 5B. In some embodiments, current may flow through the bottom sideAF coil 506 and the top side AF coil 508 in the same direction, whichmay promote forces in a common direction between the bottom side AF coil506 and magnets 502 and between the top side AF coil 508 and magnets502. Furthermore, hatching/shading as shown in the legend is used inFIGS. 5A and 5B to indicate example North and South pole orientations ofthe side magnets 502.

While an OIS coil of a magnet and coil arrangement may be configured asan inside OIS coil as described in more detail above, it should beappreciated that in other instances an OIS coil may be configured as anoutside OIS coil. FIGS. 6A and 6B illustrate one such example of amagnetic layout 600 of a voice coil motor (VCM) actuator for shifting animage sensor along multiple axes, in accordance with some embodiments.Magnetic layout 600 is shown incorporated into a housing 610 of a cameramodule, although other elements of the camera module (e.g., an imagesensor, lens, or the like) are not shown here. FIG. 6A shows a top viewof the magnetic layout 600. FIG. 6B shows a cross-sectional view of themagnetic layout 600 taken along a direction parallel to a side of thecamera module. In some embodiments, the magnetic layout 600 may includeone or multiple features, components, and/or functionality ofembodiments described herein with reference to FIGS. 1A-5B and 7A-15.

In various embodiments, the magnetic layout 600 may include a pluralityof magnets 602 configured as side magnets, one or more outside opticalimage stabilization (OIS) coils 604, and a bottom side autofocus (AF)coil 606, e.g., as shown in FIGS. 6A and 6B. For instance, the magneticlayout 600 may include four side magnets 602 that are each locatedproximate a respective side of a camera module. Each of the side magnets602 may have a respective side that faces outward, e.g., in a directiontoward the respective side of the camera module and/or in a directionopposite a central portion of the camera module. In some embodiments theoutward-facing side of a side magnet may be parallel to the respectiveside of the camera module.

The magnetic layout 600 may include a plurality of outside OIS coils 604(e.g., four outside OIS coils 604) that are each located proximate arespective outward-facing side of the side magnets 602, such that therespective side magnet is positioned between the outside OIS coil andthe optical axis, and the OIS coil is positioned between the respectiveside magnet and the housing 610. The bottom side AF coil 606 may belocated below the side magnets 602. While FIGS. 6A and 6B show the AFcoil 606 being a bottom side AF coil (i.e., positioned below the magnets602), it should be appreciated that in other instances the AF coil 406may be a top side AF coil where the AF coil is positioned above themagnets 602.

In some examples, the outside OIS coils 604 and the bottom side AF coil606 may be part of a common coil structure (not shown) that may bemovable to provide OIS and/or AF movement, while the side magnets 602may be stationary. Furthermore, in some embodiments, the outside OIScoils 604 may be oriented orthogonal to the bottom side AF coil 606(i.e., a given OIS coil may be positioned within a respective plane thatis perpendicular to the plane in which the AF coil is positioned, suchas discussed above with respect to FIGS. 1A-1D). For example, theoutside OIS coils 604 may be vertically oriented, while the bottom sideAF coil 606 may be horizontally oriented. In some instances when an OIScoil is positioned proximate a side magnet (such as shown in FIG. 6A),the plane in which the OIS coil is positioned may be parallel to arespective side of the camera module.

Example directions of current flow through the outside OIS coils 604 andthe bottom side AF coil 606 are indicated in FIG. 6B. Furthermore,hatching/shading as shown in the legend is used in FIGS. 6A and 6B toindicate example North and South pole orientations of the side magnets602.

FIGS. 7A and 7B illustrate another example magnetic layout 700 of avoice coil motor (VCM) actuator for shifting an image sensor alongmultiple axes, in accordance with some embodiments. Magnetic layout 700is shown incorporated into a housing 710 of a camera module, althoughother elements of the camera module (e.g., an image sensor, lens, or thelike) are not shown here. FIG. 7A shows a top view of the magneticlayout 700. FIG. 7B shows a cross-sectional view of the magnetic layout700 taken along a direction parallel to a side of the camera module. Insome embodiments, the magnetic layout 700 may include one or multiplefeatures, components, and/or functionality of embodiments describedherein with reference to FIGS. 1A-6B and 8A-15.

In various embodiments, the magnetic layout 700 may include a pluralityof magnets 702 configured as side magnets, one or more outside opticalimage stabilization (OIS) coils 704, a bottom side autofocus (AF) coil706, and a top side AF coil 708, e.g., as shown in FIGS. 7A and 7B. Forinstance, the magnetic layout 700 may include four side magnets 702 thatare each located proximate a respective side of a camera module. Each ofthe side magnets 702 may have a respective side that faces outward,e.g., in a direction toward the respective side of the camera moduleand/or in a direction opposite a central portion of the camera module.In some embodiments the outward-facing side of a side magnet may beparallel to the respective side of the camera module.

The magnetic layout 700 may include a plurality of outside OIS coils 704(e.g., four OIS coils) that are each located proximate a respectiveoutward-facing side of the side magnets 702 such that the respectiveside magnet is positioned between the outside OIS coil and the opticalaxis and the OIS coil is positioned between the respective side magnetand the housing 710. The bottom side AF coil 706 may be located belowthe side magnets 702. The top side AF coil 708 may be located above theside magnets 702.

In some examples, the outside OIS coils 704, the bottom side AF coil706, and/or the top side AF coil 708 may be part of a same coilstructure that may be movable to provide OIS and/or AF movement, whilethe side magnets 702 may be stationary.

Furthermore, in some embodiments, the outside OIS coils 704 may beoriented orthogonal to the bottom side AF coil 706 and/or the top sideAF coil 708. In other words, a given OIS coil may be positioned within arespective plane that is perpendicular to a plane in which the top sideor bottom side AF coil is positioned. When the bottom side AF coil 706and top side AF coil 708 are positioned in first and second parallelplanes, a given OIS coil 704 may be positioned in a respective planethat is perpendicular to both the first and second parallel planes. Forexample, the outside OIS coils 704 may be vertically oriented, while thebottom side AF coil 706 and/or the top side AF coil 708 may behorizontally oriented. In some instances when an OIS coil is positionedproximate a side magnet (such as shown in FIG. 7A), the plane in whichthe OIS coil is positioned may be parallel to a respective side of thecamera module.

Example directions of current flow through the outside OIS coils 704,the bottom side AF coil 706, and the top side AF coil 708 are indicatedin FIG. 7B. In some embodiments, current may flow through the bottomside AF coil 706 and the top side AF coil 708 in the same direction,which may promote forces in a common direction between the bottom sideAF coil 706 and magnets 702 and between the top side AF coil 708 andmagnets 702. Furthermore, hatching/shading as shown in the legend isused in FIGS. 7A and 7B to indicate example North and South poleorientations of the side magnets 702.

While the embodiments of magnet and coil arrangements depicted abovehave generally showed embodiments having the same number of magnets andOIS coils, it should be appreciated that in some embodiments the numberof OIS coils may be different than the number of magnets. For example,in some embodiments there may be fewer OIS coils than magnets. In theseembodiments, there may be one or more magnets that does not have acorresponding OIS coil positioned in proximity thereof (and thus may notmaterially add to the x-y movement of the coils), but these magnetsstill may assist with movement of the AF coil.

It should be further appreciated that the magnet and coil arrangementsdescribed here may comprise any suitable number of magnets for movingthe coils as well as different combinations of corner and side magnetsand inside and outside OIS coils. For example, while certain embodimentsdescribed above show four side magnets (one positioned adjacent eachside of the camera module), there may be fewer than four side magnets(e.g., one or more of the sides may not have a magnet positionedadjacent thereto) or more than four magnets (e.g., more than one magnetmay be positioned adjacent to each of one or more sides of the cameramodule). Additionally or alternatively, a camera module may have amagnet and coil arrangement comprising a combination of one or more sidemagnets and one or more corner magnets. Additionally or alternatively, acamera module may have a magnet and coil arrangement comprising acombination of inside OIS coils and outside OIS coils. As an example, amagnet and coil arrangement may comprise two opposing pairs of OIS coilspositioned along the same direction. In this embodiment, a firstopposing pair of OIS coils may comprise a first and second outer OIScoils and the second opposing pair of OIS coils may comprise first andsecond inner OIS coils. In these embodiments, a first magnet be positionbetween the first inner OIS coil and the first outer OIS coil while asecond magnet may be positioned between the second inner OIS coil andthe second outer OIS coil. Having two pairs of opposing OIS coils alonga common direction may increase the stability and responsiveness of theVCM actuator, but increases device complexity.

The magnet and coil arrangements of the voice coil motors described heremay further comprise one or more position sensors for detecting therelative position of one or more coils (or coil-holding structures)within a camera module. FIGS. 8A-8C illustrate an example positionsensing arrangement 800 that may be used to determine positioning of oneor more components (e.g., of a camera that includes a voice coil motor(VCM) actuator for shifting an image sensor along multiple axes), inaccordance with some embodiments. FIG. 8A shows a perspective view ofthe position sensing arrangement 800. FIG. 8B shows a top view of theposition sensing arrangement 800. FIG. 8C shows a cross-sectional viewof the position sensing arrangement 800 incorporated into a cameramodule 816. In some embodiments, the position sensing arrangement 800may include one or multiple features, components, and/or functionalityof embodiments described herein with reference to FIGS. 1A-7B and 9-15.

In some embodiments, the position sensing arrangement 800 may includeone or more position sensors 802. In various examples, the positionsensors 802 may be magnetic field sensors (e.g., Hall sensors, tunnelingmagnetoresistance (TMR) sensor, giant magnetoresistance (GMR) sensors,etc.). Each of the position sensors 802 may be attached to or otherwiselocated proximate a respective coil (e.g., an optical imagestabilization (OIS) coil 104) and/or a respective magnet of a VCMactuator. The magnet and coil arrangement 100 is shown in FIGS. 8A-8Cfor the purpose of illustration, although it should be appreciated thatthe position sensing arrangement described here may be used with any ofthe magnet and coil arrangements discussed above. For instance, theposition sensing arrangement 800 may include two position sensors 802—afirst position sensor 802 a and a second position sensor 802 b. Invarious embodiments, when magnet and coil arrangement are incorporatedinto the camera module, the OIS coils 104 may be movable, and themagnets 102 may be stationary.

For OIS, the quantity being sensed may be the magnetic field produced bythe magnet 102. For example, FIG. 8C indicates magnetic field lines 804coming out of the magnet 102. The magnetic field may include a firstmagnetic field component in a first direction, e.g., as indicated byarrow 806. As the position sensor 802 moves along the first directiontoward the magnet 102 or away from the magnet 102 (e.g., during OISoperations), the intensity of the first magnetic field component that issensed by the position sensor 802 may change. For instance, as theposition sensor 802 moves along the first direction 806 toward themagnet 102, the intensity of the first magnetic field component, assensed by the position sensor 802, may increase. As the position sensor802 moves along the first direction 806 away from the magnet 102, theintensity of the first magnetic field component, as sensed by theposition sensor 802, may decrease.

For AF, the quantity being sensed may be an angle 808 between the firstmagnetic field component and a second magnetic field component of themagnetic field produced by the magnet 102. The magnet may produce thesecond magnetic field component in a second direction, e.g., asindicated by arrow 810. In some examples, the second direction may beorthogonal to the first direction. In some instances, the positionsensor 802 may be centered with the magnet 102, e.g., centered along a zdimension of the magnet 102. In such instances, the second magneticfield component may be zero (to the position sensor 802). That is, insome embodiments, the position sensor 802 may sense the first magneticfield component but not the second magnetic field component in instancesin which the position sensor 802 is centered with the magnet 102. As theposition sensor 802 moves up or down along the second direction 810(e.g., during AF operations), the second magnetic field component at theposition sensor 802 location may changes, and thus the position sensor802 may sense changes in the angle 808 between the first magnetic fieldcomponent and the second magnetic field component.

In some variations, in order to sense the OIS movement and the AFmovement, each of the first position sensor 802 a and the secondposition sensor 802 b may be configured to output two different signals,each of which responds primarily to motion in different directionsacross the range of motion of the coil arrangement (i.e., the range ofmotion that can be achieved during typical operation of the device).Specifically, when a given signal responds primarily to motion in afirst direction, the sensitivity of the signal in response to movementacross the range of motion in the first direction (in other words, themagnitude of signal change across the stroke in the first direction)should be greater than the sensitivity of the signal in response tomovement across the respective range of motions in directions orthogonalto the first direction. The ratio of sensitivities to motion in a firstdirection relative to a second direction is referred to herein as a“cross-coupling ratio.” When a signal described here responds primarilyto motion in a primary direction, the cross-coupling ratios between aprimary direction and directions orthogonal to the primary direction maybe selected based on the sensitivity of the system, but it is generallydesirable to set the cross-coupling ratio (sensitive in the orthogonaldirection divided by sensitivity in the primary direction) to be assmall as possible. For example, in some instances it may be desirablefor the cross coupling ratio to be less than 0.25 (i.e., the signal isat least 4 times as sensitive in the primary direction than it is in anorthogonal direction), or more preferable less than 0.1 (i.e., assensitive in the primary direction than it is in an orthogonaldirection).

Each of the first position sensor 802 a and the second position sensor802 b may output two signals, a first signal that responds primarily tomotion in a first direction (e.g., the z direction) and a second signalthat responds primarily to motion in a second direction orthogonal tothe first direction (e.g., a direction in the x-y plane). For example,in the arrangement of FIGS. 8A-8C, the first position sensor 802 a mayoutput a first signal that primarily responds to motion in thez-direction (not shown) and second signal that primarily responds tomotion in a first direction 812 in the x-y plane. The second positionsensor 802 b may output a first signal that primarily responds to motionin the z-direction and a second signal that primarily responds to motionin a second direction 814, the second direction 814 being in the x-yplane and perpendicular to the first direction 812. It should be notedthat the first position sensor 802 a and/or the second position sensor802 b may each comprise two or more discrete sensor elements that eachmay be positioned or otherwise configured to be sensitive primarily tomagnetic field changes in a particular direction, and may collectivelyprovide the first and second output signals for the respective positionsensor.

The four signals (i.e., the first and second signals of the firstposition sensor 802 a and the first and second signals of the secondposition sensor 802 b) may be used to determine the position (and insome instances orientation) of the coil arrangement relative to themagnets 102 (and thus the rest of the camera). For example, the signalsthat respond primarily to movement in the z direction may be used todetect autofocus movement such as described in more detail above. Insome instances, only one of the first and second position sensors mayprovide a signal that responds primarily to movement in the z direction,although instances where both position sensors output such a signal mayincrease reliability, as well as allow for the calculation of tilt ofthe coil arrangement in a given direction by measuring a differencebetween the signals. Additionally, the signals that respond primarily tomovement in the first direction 812 and the second direction 814 may beused to detect OIS motion.

In some embodiments, the position sensing arrangement 800 may include aposition sensor 802 for each pair of opposing magnets 102. In someexamples, the first position sensor 802 a may be attached to one OIScoil 104 of a pair of opposing OIS coils 104, and the second positionsensor 802 b may be attached to one OIS coil 104 of another pair ofopposing OIS coils 104. As shown in FIGS. 8A and 8B, the positionsensing arrangement 800 may include two position sensors 802, each ofwhich may sense OIS movement in a respective direction. The firstposition sensor 802 a may be used to sense OIS movement in a firstdirection, and the second position sensor 802 b may be used to sense OISmovement in a second direction. In various embodiments, the seconddirection may be orthogonal to the first direction. Each of the positionsensors 802 may be used to sense AF movement. Furthermore, the positionsensors 802 may be used to sense tilt movement about at least one axis.

Although not shown in FIGS. 8A and 8B, the position sensing arrangement800 may include a position sensor 802 for each magnet in someembodiments. In some examples, each of the position sensors 802 may beattached to a respective OIS coil. A first pair of position sensors 802that correspond to a first pair of opposing magnets may be used to senseOIS movement in a first direction 812, and a second pair of positionsensors 802 that correspond to a second pair of opposing magnets may beused to sense OIS movement in a second direction 814. In variousembodiments, the second direction 814 may be orthogonal to the firstdirection 812. Each of the position sensors 802 may be used to sense AFmovement. Furthermore, the first pair of position sensors 802 may beused to sense tilt movement about a first axis, and the second pair ofposition sensors 802 may be used to sense tilt movement about a secondaxis. In various embodiments, the second axis may be orthogonal to thefirst axis.

In some embodiments, the position sensing arrangement 800 mayadditionally, or alternatively, include one or more position sensors 802underneath a substrate portion that carries the AF coil 106.

In various embodiments, the position sensors 802 of the position sensingarrangement 800 may sense magnetic field components of the drive magnets102 as discussed above, without the need to include separate probemagnets for the position sensors 802 to sense.

In various embodiments, the position sensing arrangement 800 describedherein may mitigate cross coupling sensed by the position sensors 802during OIS and AF operations compared to some other position sensingarrangements.

One or more portions of the magnet and coil arrangements discussed abovemay be supported by a flexure arrangement that may help control relativemovement between the magnets and coils. FIGS. 9A and 9B illustrate anexample flexure arrangement 900 (e.g., for a camera that includes avoice coil motor (VCM) actuator for shifting an image sensor alongmultiple axes), in accordance with some embodiments. FIG. 9A shows aperspective view of the flexure arrangement 900. FIG. 9B shows across-sectional view of the flexure arrangement 900 in a camera 902 thatincludes a VCM actuator for shifting an image sensor along multipleaxes. In some embodiments, the flexure assembly 900 may include one ormultiple features, components, and/or functionality of embodimentsdescribed herein with reference to FIGS. 1A-8C and 10A-15. FIG. 9B showthe camera 902 as comprising a position sensing arrangement 800 asdescribed above with respect to FIGS. 8A-8C, although it should beappreciated that the camera 902 may incorporate any suitable positionsensing system for monitoring the relative movement of the VCM actuator.

According to various embodiments, the camera 902 may include a lens 904,an image sensor 906, and a VCM actuator 908. The lens 904 may includeone or more lens elements that define an optical axis 910. The imagesensor 906 may be configured to capture light passing through the lens904 and convert the captured light into image signals. The path of lightas it impinges on the image sensor 906 may be referred to as the opticalaxis 910. In various embodiments, the VCM actuator 908 may include theflexure arrangement 900, one or more magnets 912, one or more opticalimage stabilization (OIS) coils 914, one or more autofocus (AF) coils916, and a coil carrier 918. The one or more magnets 912, one or moreOIS coils, and one or more AF coils may have any suitable arrangement asdiscussed above, such as, for example, one of the arrangements describedabove with relation to FIGS. 1A-7B.

The magnets 912 and the coils 914, 916 may magnetically interact, e.g.,to produce Lorentz forces that cause the coil carrier 918 to shift alongmultiple axes. For instance, the coil carrier 918 may move in directionsorthogonal to the optical axis 910 (e.g., along the x-y plane) toprovide OIS. Additionally, or alternatively, the coil carrier 918 maymove along the optical axis 910 (e.g., along the z axis) to provide AF.

In various embodiments, the image sensor 906 may be configured to shifttogether with, and in a similar manner as, the coil carrier 918. Inthese embodiments, the one or more AF coils 916, the one or more OIScoils 914, and image sensor 906 may be held in a fixed relationship(referred to herein as the coil-sensor arrangement). The coil-sensorarrangement may be connected in any suitable manner, and the coil-sensorarrangement may comprise one or more holding structures for holding thecoils and image sensor. For instance, the image sensor 906 may beattached to a substrate 920 of the camera 902 (and/or of the VCMactuator 908), and the substrate 920 may in turn be attached to the coilcarrier 918 (either directly or via one or more intermediatestructures). In variations where the AF coil 916 is a bottom AF coil (asshown in FIGS. 9A and 9B), the AF coil 916 (or a flex circuit holdingthe AF coil 916) may be directly connected to the substrate 920, whichin some instances may allow for one or more electrical signals to beprovided to one or more of the coils via electrical connections on thesubstrate 920. In some examples, the image sensor 906 may be attached toa bottom portion of the substrate 920. The substrate 920 may be attachedto a bottom portion of the coil carrier 918 in some embodiments.Furthermore, the substrate 920 may be attached to a movable portion ofthe flexure arrangement 900, e.g., to the movable platform 928 discussedbelow. In other embodiments, the image sensor may be connected directlyto the coil carrier. In some instances, the camera 902 may comprise oneor more additional structures such as a bumper 950. The bumper 950 maybe connected to a portion of the coil-sensor arrangement (e.g., anunderside of the substrate 920), and may provide a stop for movement ofthe coil-sensor arrangement toward a bottom of the camera.

In various embodiments, the magnets 912 may be attached to a magnetholder 922. The magnet holder 922 may be a stationary component withinthe camera 902. As such, the magnets 912 may be stationary relative toone or more moving components of the camera 902.

In various embodiments, the OIS coils 914 and the AF coils 916 may beformed of a common coil structure, e.g., as described herein withreference to FIGS. 1A-1D and 12A-12D. For instance, the coil structuremay be formed of a flex circuit. In various embodiments, the coilstructure may be manufactured as a flat coil structure with tab portionsthat are foldable, e.g., as described herein with reference to FIGS.12A-12D. In some embodiments, the tab portions hold or include the OIScoils 914. Furthermore, the tab portions may extend from a base portionthat holds or includes the AF coil(s) 916. In some cases, the baseportion and/or the AF coil(s) 916 may form a ring around, or otherwisesurround, the coil carrier 918 and/or the lens 904. The flex circuit mayin turn be connected to the coil holder 918, such as discussed belowwith reference to FIGS. 12A-12D. As mentioned above, a portion of theflex circuit may also be connected to the substrate 920.

The flexure arrangement 900 may be configured to suspend the coil-sensorarrangement (or a coil-lens embodiment in instances where the coilarrangement moves the lens 904 within camera 902). In some embodiments,the flexure arrangement 900 may include a bottom flexure 924 and a topflexure 926. The bottom flexure 924 and the top flexure 926 may, in somecases, cooperatively provide compliance for movement (e.g., of the imagesensor) in directions orthogonal to the optical axis 910 (e.g., for OIS)and/or along the optical axis 910 (e.g., for AF). According to variousembodiments, the bottom flexure 924 and the top flexure 926 help guidemotion of the substrate 920 (to which the image sensor 906 may beattached) and/or the image sensor 906 in a controlled manner. In someexamples, the bottom flexure portion 924 may primarily provide guidancefor OIS movement, and the top flexure portion 926 may primarily provideguidance for AF movement.

In some examples, the bottom flexure 924 may include a movable platform928, a stationary platform 930, and one or more flexure arms 932 thatconnect the movable platform 928 to the stationary platform 930. Thestationary platform 930 may be connected to a stationary component ofthe camera 902. For instance, the stationary platform 930 may beattached to a base 934 of the camera 902. In some embodiments, thesubstrate 920 may be attached to the movable portion 928 of the bottomflexure 924, and the image sensor 906 may be attached to the substrate920. For example, in some variations moveable portion 928 may beconnected to a bottom surface of the substrate 920. The substrate 920and the image sensor 906 may move along with, and in the same manner as,the movable portion 928 of the bottom flexure 924 in some embodiments.

In some examples, the top flexure 926 may include a leaf portion 936 anda wire portion comprising one or more wires 938. The leaf portion 936may be made of a sheet, which may be etched into a specific pattern.Generally, the leaf portion 936 may be suspended in the camera such thatthe leaf portion 936 (not flexed) is positioned within a plane that isperpendicular to the optical axis of the camera 902. Specifically, theone or more wires 938 of the may connect the leaf portion 936 to anotherportion of the camera 902 (e.g., a stationary portion of the camera) tosuspend the leaf portion 936. In some embodiments, the leaf portion 936may be attached to the top ends of the wires 938 and the bottom ends ofthe wires 938 may be attached to a stationary component 944 of thecamera 902 (which may be any stationary portion of the camera 902) suchthat the leaf portion 936 is positioned above the wires 938. In otherembodiments the bottom ends of the wires 938 are attached to the leafportion 906 while the top ends of the wires 938 are attached to astationary portion of the camera 902 such that the leaf portion ispositioned below the wires 938. In still other embodiments, the leafportion 906 may be attached to an intermediate portion of the wires 938(i.e., near the middle of the wires). In these embodiments, one or bothends of each wire 938 may be connected to stationary portions of thecamera. It should also be appreciated that different wires 938 may havedifferent attachment approaches of those discussed above (e.g., the leafportion 906 may be connected to the top end or ends of a first wire orgroup of wires and may be connected to the bottom end or ends of asecond wire or group of wires). The wires 938 may be attached to theleaf portion 936 or stationary portions of the camera 902 any suitablemanner, such as, for example, via solder 942.

The leaf portion 936 may be formed with any suitable cross-sectionalpattern. In the embodiment shown in FIG. 9A, the leaf portion 936 maycomprise a plurality of petals 937, each of which may connect to adifferent respective wire 938 of the wire portion. Each petal 937 maycomprise two arms that branch from the connection with a respective wire938, and connect to a portion of the coil-sensor (or coil-lens)arrangement, either directly or via an inside ring portion 946 discussedin more detail below. While shown in FIG. 9A as having two branchingarms, it should be appreciated that a petal may have any suitable numberof arms (e.g., one, two, or three or more) connecting the respectivewire 938 to the coil-sensor arrangement. Additionally, while shown inFIG. 9A as having four petals each forming an irregular pentagon shape,the leaf portion 936 may have any suitable number of petals (e.g., two,three, four, or five or more) and may have either all petals having thesame shape or different petals having different shapes. Suitable shapesinclude, but are not limited to semicircles, triangles, irregularpolygons and the lie.

In some embodiments, the leaf portion 936 of the top flexure 926 mayinclude an inside ring portion 946. The inside ring portion 946 may beconnected to a top portion or surround an exterior portion of the coilcarrier 918. While the inside ring portion 946 is shown in FIG. 9A asfully circumscribing the optical axis of the camera 902, it should beappreciated that the leaf portion 936 may only partially surround theoptical axis of the camera 902. Indeed, in some variations the leafportion 936 may comprise a plurality of separate pieces that areindividually and independently attached to the coil-sensor arrangement.For example, in some variations each petal of leaf portion 936 may beformed from a separate piece and may be separately connected to thecoil-sensor arrangement.

Collectively the top flexure 926 and bottom flexure 924 may suspend thecoil-sensor arrangement relative to the rest of the camera 902. Forexample, the top flexure 926 may be connected to the coil carrier 918while the bottom flexure 924 may be connected to the substrate 920 towhich the image sensor 906 may be connected. The substrate 920 may beconnected to the coil carrier 918. The coil carrier 918 may bridge thetop flexure 926 with the bottom flexure 924 in some embodiments.

In various embodiments, the top flexure 926 and/or bottom flexure 924may advantageously be used to route one or more signals to or from thecoil-sensor arrangement, but need not (e.g., one or more flex circuitsmay carry traces between the coil-sensor arrangement and a stationaryportion of the camera). For example, image sensor data from the imagesensor may be routed from the coil-sensor arrangement to otherprocessing circuitry elsewhere in the camera or a device into which thecamera is incorporated. Additionally, power and other signals used todrive the AF and OIS coils may be routed to the coil-sensor arrangement.For example, signals from the image sensor may be conveyed to thesubstrate 920, which in turn may be conveyed to the flexure arrangement.For example, one or more signals may be routed via traces on one or moreof the flexures arms 932. As an example, image signals may be conveyedfrom the substrate 920 to the movable platform 928, and from the movableplatform 928 to the stationary platform 930 via electrical traces on theflexure arms 932. Not every flexure arm 932 need have a trace dependingon the number of traces needed, and a given flexure arm 932 may have asingle or multiple traces. Additionally or alternatively, top flexure926 may carry one or more signals. In these variations, a wire 938 ofthe wire portion may be conductive or otherwise carry a conductivetrace, which in turn may be connected to a conductive portion of theleaf portion 936 (e.g., the leaf portion may be formed from a conductivematerial and/or may have a conductive trace deposited thereon), which inturn may be connected to and route signals via a portion of thecoil-sensor arrangement (e.g., a conductive portion of the coil carrier918).

It should be appreciated that electrical signals within the coil-signalarrangement may be routed in any suitable manner. For example, thesubstrate 920 may provide one or more electrical pathways for connectingthe image sensor to traces on the bottom flexure. Additionally oralternatively, the substrate 920 may comprise one or more electricalpathways that connect a flex circuit of the coil arrangement to one ormore traces on the bottom flexure (which may allow for signals to bepassed to one or more of the coils via the flex circuit). Additionallyor alternatively the substrate 920 may comprise one or more electricalpathways that electrically connect one or more traces on the bottomflexure to a coil carrier 918 (which in turn may be used to routesignals to one or more coils such as described in more detail below).Similarly the coil carrier 918 may comprise one or more electricalpathways for connecting the top flexure to other components (e.g., oneor more coils, the image sensor, or one or more additional electricalcomponents supported by the coil-sensor arrangement).

In some cases, the lens 904 may be held by a lens holder 946. The lens904 and/or the lens holder 946 may be connected to a stationarycomponent of the camera 902 such that the lens 904 may be fixed relativeto moving components of the camera 902. For instance, the lens 904and/or the lens holder 946 may be connected to the shield can 940, themagnet holder 922, and/or the substrate 920 (which may be connected tothe shield can 940).

In some embodiments, the bottom flexure 924 may include one or moreflexure stabilizers 948 to stabilize movement of the flexure arms 932.For instance, the flexure stabilizers 948 may prevent the flexure armsfrom 932 from colliding or otherwise interfering with one another.

FIGS. 10A-10C illustrate example compliance provided by the exampleflexure arrangement 900 of FIGS. 9A and 9B in response to differenttypes of motion, in accordance with some embodiments. FIG. 10A shows anexample of how the flexure arrangement 900 may move in response toautofocus (AF) motion. During AF motion, as the coil-sensor arrangement(not shown) moves up or down in the z-direction, some or all of theflexure arms 932 of the bottom flexure 924 may flex in the z-directionand one or more segments of the leaf portion 936 (e.g., the petals 937)may flex in the z-direction. FIG. 10B shows an example of how theflexure arrangement 900 may move in response to optical imagestabilization (OIS) motion in a first direction. FIG. 10C shows anexample of how the flexure arrangement 900 may move in response to OISmotion in a second direction that is opposite the first direction.During OIS motion while the coil-sensor arrangement (not shown) moves inthe x-y plane, some or all of the flexure arms 932 of the bottom flexure924 will flex in the x-y plane, while the wires 938 of the top flexurewill flex in the direction that the coil-sensor arrangement moves.Generally the leaf portion 936 is stiffer than the wires 938 in the xand y directions while the wires 938 are stiffer than the leaf portion936 in the z direction, which is why the leaf portion 936 will primarilyflex during the AF movement and the wires 938 will primarily flex duringthe OIS movement. The relative flexibility of the components of the topand bottom flexures may be selected to provide different levels ofsupport/resistance to movement in different directions. In someembodiments, the examples of compliance provided by the example flexurearrangement 900 may include one or multiple features, components, and/orfunctionality of embodiments described herein with reference to FIGS.1A-9B and 11A-15.

In some variations, the camera may be configured to damp movement of oneor both of the top and bottom flexures of the flexure arrangementsdescribed here. FIGS. 11A and 11B illustrate perspective views of anexample camera 1100 and example locations within for placement of aviscoelastic material (e.g., a gel) within the camera 1100 for dampingpurposes, in accordance with some embodiments. In various embodiments,the camera 1100 may include a voice coil motor (VCM) actuator forshifting an image sensor along multiple axes), in accordance with someembodiments. In some embodiments, the example locations and/or thecamera 1100 may include one or multiple features, components, and/orfunctionality of embodiments described herein with reference to FIGS.1A-10C and 12A-15. Various components described above with respect toFIGS. 9A and 9B are shown in these figures, and are labeled accordingly.

FIG. 11A shows a first set of one or more locations 1102 and a secondset of one or more locations 1104 for placement of the viscoelasticmaterial for damping. In some embodiments, the first set of locations1102 may be between a magnet holder 922 (or other stationary portion ofthe camera 1100) and a wire 938 (which may move) of a wire portion ofthe top flexure 926. In some examples, the second set of locations 1104may be between the magnet holder 922 (or other stationary portion of thecamera 1100) and a leaf portion 936 (which may move) of the top flexure926.

FIG. 11B shows a third set of one or more locations 1106 for placementof the viscoelastic material for damping. In some embodiments, the thirdset of locations 1106 may be between flexure arms 932 (which may move)of the bottom flexure 924 and a base component 934 (which may bestationary). It should be understood, however, that in variousembodiments the viscoelastic material may additionally or alternativelybe placed in other locations between moving and stationary componentsfor damping purposes.

While flexure arrangement 900 has been discussed as configured tosuspend a coil and image sensor arrangement, in other embodiments aflexure arrangement including any or all the features described hereinand shown in FIGS. 9A-B, 10A-C and 11A-B may be configured to suspend acoil-lens assembly (e.g., in instances where the coil arrangement moveslens 904 within camera 902). Modifications as would be evident havingbenefit of this disclosure may be needed in regard to the shape, size,thickness, etc. of certain features of the flexure arrangement inembodiments in which the flexure arrangement is configured to suspend alens or lens stack within a camera.

FIG. 12A illustrates a perspective view of an example coil assembly 1200by which one or more optical image stabilization coils and one or moreautofocus coils may be held in a fixed relationship, in accordance withsome embodiments. FIG. 12B illustrates a perspective view of an examplecoil carrier 1202, in accordance with some embodiments. FIGS. 12C and12D illustrate perspective views of an example coil structure 1204, inaccordance with some embodiments. In some embodiments, the coilstructure and coil carrier assembly 1200, the coil carrier 1202, and/orthe coil structure 1204 may be used in conjunction with one or more ofembodiments described herein with reference to FIGS. 1A-11B and 13-15.

In some embodiments, the coil assembly 1200 may include the coil carrier1202 and the coil structure 1204. The coil carrier 1202 comprises a bodythat may hold and support the coil structure 1204, and may provide aconnection point for the coil assembly 1200 to other components of thecamera (e.g., the top and/or bottom flexure of a flexure arrangement,and/or a substrate, such as those described above in relation to FIGS.9A and 9B). The coil carrier 1202 may be formed from a single monolithicpiece of material, or may be assembled from a plurality of discretepieces. In some embodiments the coil carrier 1202 may comprise one ormore traces or electrical interconnects, which may be used to routeelectrical signals (e.g., drive signals for the coils) to coil structure1204 or other components in the camera. According to some embodiments,the coil carrier 1202 may be configured to surround at least a portionof a lens and/or a lens holder of a camera. For example, coil carrier1202 may define an aperture 1228 extending through the coil carrier1202. When the coil carrier 1202 is incorporated into a coil-sensorarrangement of a camera, as discussed in more detail above, the coilcarrier 1202 may be positioned such that light to be captured by thecamera needs to pass through the aperture to reach and be measured bythe image sensor. The coil carrier may be further positioned within thecamera such that at least a portion of a lens and/or a lens holder of acamera extends at least partially through the aperture.

Turning to FIGS. 12C and 12D, in various embodiments, the coil structure1204 may include a base portion 1206 and one or more tab portions 1208.The base portion 1206 may define an aperture 1230 extending at leastpartially therethrough, and that may allow light to pass through thecoil structure 1204 to reach the image sensor (in instances where theimage sensor is positioned beneath the base portion 1206. The baseportion 1206 may include one or more autofocus (AF) coils 1210. In someembodiments, the base portion 1206 may include a single AF coil 1210,e.g., as shown in FIGS. 12A-12C. In some examples, the base portion 1206and the AF coil 1210 may be ring shaped. Furthermore, in some examples,the base portion 1206 and/or the AF coil 1210 may be attached to abottom portion of the coil carrier 1202 in some embodiments. In someembodiments, the coil carrier 1202 may include one or more protrusions1212 to which the base portion 1206 and/or the AF coil 1210 may beattached. In some of these embodiments, one or more the protrusions 1212may be used to route electrical signals to the AF coil 1210 and/or theOIS coils.

In some embodiments, each of the tab portions 1208 may include arespective optical image stabilization (OIS) coil 1214. The tab portions1208 may extend from the base portion 1206. In some embodiments (such asthe one shown in FIGS. 12C and 12D), one or more of the tab portions1208 may extend from an interior of the base portion 1206, which may inturn be used to create a magnet and coil arrangement having inner OIScoils (such as those embodiments discussed above with respect to FIGS.2A-5B). In these instances, a given OIS coil may be positioned between amagnet and the coil carrier 1202. In other variations, one or more ofthe tab portions may extend from an exterior of the base portion 1206,which may be used to create a magnet and coil arrangement having outerOIS coils (such as those embodiments discussed above with respect toFIGS. 6A-7B). In these variations, a given OIS coil may have a magnetpositioned between the OIS coil and the coil carrier 1202.

In some embodiments of the coil assembly 1200, one or more OIS coils1214 may be attached to and/or located proximate one or more outersurfaces of the coil carrier 1202. When an OIS coil is attached to anouter surface of the coil carrier 1202, this attachment may also providean electrical connection between the coil carrier 1202 and the OIS coil1214. In some examples, the coil carrier 1202 may include one or morerecesses 1216 within which at least a portion of the OIS coils 1214 maybe located.

In various embodiments, the coil structure 1204 may be constructed of asingle flat circuit, e.g., as illustrated in FIG. 12C. For instance, theAF coil 1210, the OIS coils 1214, and/or other components may be formedon a substrate 1218 in an additive deposition process to produce a flatcircuit in some embodiments.

In some examples, the tab portions 1208 of the coil structure 1204 mayinclude fold portions 1220 at which the tab portions 1208 may be foldedto orient the OIS coils 1214 at an angle relative to the AF coil 1210,e.g., as shown in FIG. 12D. In some embodiments, the OIS coils 1214 maybe oriented vertically and the AF coil 1210 may be orientedhorizontally. Each of the OIS coils 1214 may define a respective planethat is orthogonal to a plane defined by the AF coil 1210.

In variations where a coil arrangement 1200 comprises one or moreposition sensor 1222 (e.g., the position sensors 802 discussed hereinwith reference to FIGS. 8A-8C), the position sensor may be attached toeither the coil structure 1204 or the coil carrier 1202. For example, insome variations, the position sensors may be mounted to a portion of thecoil structure 1204, such as the circuit substrate on which the coilsare built. For example, a small finger of substrate material 1218 mayextend into the center region of one or more of the coils, such as shownat 1222. One or more of the position sensors may be mounted to thefinger(s) 1222 of coil structure 1204, and signals to and/or from theposition sensors may be routed through the circuit substrate material ofcoil structure 1204. In some of these embodiments, the coil carrier 1202may include one or more recesses and/or windows 1224. In someembodiments, a position sensor may be located at least partially withina window 1224 to save space in the x and/or y dimensions of a camerathat includes the coil structure and coil carrier assembly 1200. Inother instances, one or more position sensors may be connected directlyto the coil carrier 1202 (e.g., within a window or recess) and the coilcarrier 1202 may include one or more electrical traces for carryingsignals to and/or from the position sensor.

FIG. 13 illustrates a block diagram of an example portable multifunctiondevice 1300 that may include one or more cameras, in accordance withsome embodiments. In some embodiments, at least one camera of theportable multifunction device 1300 may include one or multiple features,components, and/or functionality of embodiments described herein withreference to FIGS. 1A-12D, 14, and 15.

Camera(s) 1364 is sometimes called an “optical sensor” for convenience,and may also be known as or called an optical sensor system. Device 1300may include memory 1302 (which may include one or more computer readablestorage mediums), memory controller 1322, one or more processing units(CPUs) 1320, peripherals interface 1318, RF circuitry 1308, audiocircuitry 1310, speaker 1311, touch-sensitive display system 1312,microphone 1313, input/output (I/O) subsystem 1306, other input orcontrol devices 1316, and external port 1324. Device 1300 may includeone or more optical sensors 1364. These components may communicate overone or more communication buses or signal lines 1303.

It should be appreciated that device 1300 is only one example of aportable multifunction device, and that device 1300 may have more orfewer components than shown, may combine two or more components, or mayhave a different configuration or arrangement of the components. Thevarious components shown in FIG. 13 may be implemented in hardware,software, or a combination of hardware and software, including one ormore signal processing and/or application specific integrated circuits.

Memory 1302 may include high-speed random access memory and may alsoinclude non-volatile memory, such as one or more magnetic disk storagedevices, flash memory devices, or other non-volatile solid-state memorydevices. Access to memory 1302 by other components of device 1300, suchas CPU 1320 and the peripherals interface 1318, may be controlled bymemory controller 1322.

Peripherals interface 1318 can be used to couple input and outputperipherals of the device to CPU 1320 and memory 1302. The one or moreprocessors 1320 run or execute various software programs and/or sets ofinstructions stored in memory 1302 to perform various functions fordevice 1300 and to process data.

In some embodiments, peripherals interface 1318, CPU 1320, and memorycontroller 1322 may be implemented on a single chip, such as chip 1304.In some other embodiments, they may be implemented on separate chips.

RF (radio frequency) circuitry 1308 receives and sends RF signals, alsocalled electromagnetic signals. RF circuitry 1308 converts electricalsignals to/from electromagnetic signals and communicates withcommunications networks and other communications devices via theelectromagnetic signals. RF circuitry 1308 may include well-knowncircuitry for performing these functions, including but not limited toan antenna system, an RF transceiver, one or more amplifiers, a tuner,one or more oscillators, a digital signal processor, a CODEC chipset, asubscriber identity module (SIM) card, memory, and so forth. RFcircuitry 1308 may communicate with networks, such as the Internet, alsoreferred to as the World Wide Web (WWW), an intranet and/or a wirelessnetwork, such as a cellular telephone network, a wireless local areanetwork (LAN) and/or a metropolitan area network (MAN), and otherdevices by wireless communication. The wireless communication may useany of a variety of communications standards, protocols andtechnologies, including but not limited to Global System for MobileCommunications (GSM), Enhanced Data GSM Environment (EDGE), high-speeddownlink packet access (HSDPA), high-speed uplink packet access (HSDPA),wideband code division multiple access (W-CDMA), code division multipleaccess (CDMA), time division multiple access (TDMA), Bluetooth, WirelessFidelity (Wi-Fi) (e.g., IEEE 802.11a, IEEE 802.11b, IEEE 802.11g and/orIEEE 802.11n), voice over Internet Protocol (VoIP), Wi-MAX, a protocolfor e-mail (e.g., Internet message access protocol (IMAP) and/or postoffice protocol (POP)), instant messaging (e.g., extensible messagingand presence protocol (XMPP), Session Initiation Protocol for InstantMessaging and Presence Leveraging Extensions (SIMPLE), Instant Messagingand Presence Service (IMPS)), and/or Short Message Service (SMS), or anyother suitable communication protocol, including communication protocolsnot yet developed as of the filing date of this document.

Audio circuitry 1310, speaker 1311, and microphone 1313 provide an audiointerface between a user and device 1300. Audio circuitry 1310 receivesaudio data from peripherals interface 1318, converts the audio data toan electrical signal, and transmits the electrical signal to speaker1311. Speaker 1311 converts the electrical signal to human-audible soundwaves. Audio circuitry 1310 also receives electrical signals convertedby microphone 1313 from sound waves. Audio circuitry 1310 converts theelectrical signal to audio data and transmits the audio data toperipherals interface 1318 for processing. Audio data may be retrievedfrom and/or transmitted to memory 1302 and/or RF circuitry 1308 byperipherals interface 1318. In some embodiments, audio circuitry 1310also includes a headset jack (e.g., 1412, FIG. 14). The headset jackprovides an interface between audio circuitry 1310 and removable audioinput/output peripherals, such as output-only headphones or a headsetwith both output (e.g., a headphone for one or both ears) and input(e.g., a microphone).

I/O subsystem 1306 couples input/output peripherals on device 1300, suchas touch screen 1312 and other input control devices 1316, toperipherals interface 1318. I/O subsystem 1306 may include displaycontroller 1356 and one or more input controllers 1360 for other inputor control devices. The one or more input controllers 1360 receive/sendelectrical signals from/to other input or control devices 1316. Theother input control devices 1316 may include physical buttons (e.g.,push buttons, rocker buttons, etc.), dials, slider switches, joysticks,click wheels, and so forth. In some alternate embodiments, inputcontroller(s) 1360 may be coupled to any (or none) of the following: akeyboard, infrared port, USB port, and a pointer device such as a mouse.The one or more buttons (e.g., 1408, FIG. 14) may include an up/downbutton for volume control of speaker 1311 and/or microphone 1313. Theone or more buttons may include a push button (e.g., 1406, FIG. 14).

Touch-sensitive display 1312 provides an input interface and an outputinterface between the device and a user. Display controller 1356receives and/or sends electrical signals from/to touch screen 1312.Touch screen 1312 displays visual output to the user. The visual outputmay include graphics, text, icons, video, and any combination thereof(collectively termed “graphics”). In some embodiments, some or all ofthe visual output may correspond to user-interface objects.

Touch screen 1312 has a touch-sensitive surface, sensor or set ofsensors that accepts input from the user based on haptic and/or tactilecontact. Touch screen 1312 and display controller 1356 (along with anyassociated modules and/or sets of instructions in memory 1302) detectcontact (and any movement or breaking of the contact) on touch screen1312 and converts the detected contact into interaction withuser-interface objects (e.g., one or more soft keys, icons, web pages orimages) that are displayed on touch screen 1312. In an exampleembodiment, a point of contact between touch screen 1312 and the usercorresponds to a finger of the user.

Touch screen 1312 may use LCD (liquid crystal display) technology, LPD(light emitting polymer display) technology, or LED (light emittingdiode) technology, although other display technologies may be used inother embodiments. Touch screen 1312 and display controller 1356 maydetect contact and any movement or breaking thereof using any of avariety of touch sensing technologies now known or later developed,including but not limited to capacitive, resistive, infrared, andsurface acoustic wave technologies, as well as other proximity sensorarrays or other elements for determining one or more points of contactwith touch screen 1312. In an example embodiment, projected mutualcapacitance sensing technology is used.

Touch screen 1312 may have a video resolution in excess of 800 dpi. Insome embodiments, the touch screen has a video resolution ofapproximately 860 dpi. The user may make contact with touch screen 1312using any suitable object or appendage, such as a stylus, a finger, andso forth. In some embodiments, the user interface is designed to workprimarily with finger-based contacts and gestures, which can be lessprecise than stylus-based input due to the larger area of contact of afinger on the touch screen. In some embodiments, the device translatesthe rough finger-based input into a precise pointer/cursor position orcommand for performing the actions desired by the user.

In some embodiments, in addition to the touch screen, device 1300 mayinclude a touchpad (not shown) for activating or deactivating particularfunctions. In some embodiments, the touchpad is a touch-sensitive areaof the device that, unlike the touch screen, does not display visualoutput. The touchpad may be a touch-sensitive surface that is separatefrom touch screen 1312 or an extension of the touch-sensitive surfaceformed by the touch screen.

Device 1300 also includes power system 1362 for powering the variouscomponents. Power system 1362 may include a power management system, oneor more power sources (e.g., battery, alternating current (AC)), arecharging system, a power failure detection circuit, a power converteror inverter, a power status indicator (e.g., a light-emitting diode(LED)) and any other components associated with the generation,management and distribution of power in portable devices.

Device 1300 may also include one or more optical sensors or cameras1364. FIG. 13 shows an optical sensor 1364 coupled to optical sensorcontroller 1358 in I/O subsystem 1306. Optical sensor 1364 may includecharge-coupled device (CCD) or complementary metal-oxide semiconductor(CMOS) phototransistors. Optical sensor 1364 receives light from theenvironment, projected through one or more lens, and converts the lightto data representing an image. In conjunction with imaging module 1343(also called a camera module), optical sensor 1364 may capture stillimages or video. In some embodiments, an optical sensor 1364 is locatedon the back of device 1300, opposite touch screen display 1312 on thefront of the device, so that the touch screen display 1312 may be usedas a viewfinder for still and/or video image acquisition. In someembodiments, another optical sensor is located on the front of thedevice so that the user's image may be obtained for videoconferencingwhile the user views the other video conference participants on thetouch screen display. At least one, several, or all cameras 1364 of theportable multifunction device 1300 may include one or multiple features,components, and/or functionality of embodiments described herein withreference to FIGS. 1A-12D, 14, and 15.

Device 1300 may also include one or more proximity sensors 1366. FIG. 13shows proximity sensor 1366 coupled to peripherals interface 1318.Alternately, proximity sensor 1366 may be coupled to input controller1360 in I/O subsystem 1306. In some embodiments, the proximity sensor1366 turns off and disables touch screen 1312 when the multifunctiondevice 1300 is placed near the user's ear (e.g., when the user is makinga phone call).

Device 1300 includes one or more orientation sensors 1368. In someembodiments, the one or more orientation sensors 1368 include one ormore accelerometers (e.g., one or more linear accelerometers and/or oneor more rotational accelerometers). In some embodiments, the one or moreorientation sensors 1368 include one or more gyroscopes. In someembodiments, the one or more orientation sensors 1368 include one ormore magnetometers. In some embodiments, the one or more orientationsensors 1368 include one or more of global positioning system (GPS),Global Navigation Satellite System (GLONASS), and/or other globalnavigation system receivers. The GPS, GLONASS, and/or other globalnavigation system receivers may be used for obtaining informationconcerning the location and orientation (e.g., portrait or landscape) ofdevice 1300. In some embodiments, the one or more orientation sensors1368 include any combination of orientation/rotation sensors. FIG. 13shows the one or more orientation sensors 1368 coupled to peripheralsinterface 1318. Alternately, the one or more orientation sensors 1368may be coupled to an input controller 1360 in I/O subsystem 1306. Insome embodiments, information is displayed on the touch screen display1312 in a portrait view or a landscape view based on an analysis of datareceived from the one or more orientation sensors 1368.

In some embodiments, the software components stored in memory 1302include operating system 1326, communication module (or set ofinstructions) 1328, contact/motion module (or set of instructions) 1330,graphics module (or set of instructions) 1332, text input module (or setof instructions) 1334, Global Positioning System (GPS) module (or set ofinstructions) 1335, arbiter module 1358 and applications (or sets ofinstructions) 1336. Furthermore, in some embodiments memory 1302 storesdevice/global internal state 1357. Device/global internal state 1357includes one or more of: active application state, indicating whichapplications, if any, are currently active; display state, indicatingwhat applications, views or other information occupy various regions oftouch screen display 1312; sensor state, including information obtainedfrom the device's various sensors and input control devices 1316; andlocation information concerning the device's location and/or attitude.

Operating system 1326 (e.g., Darwin, RTXC, LINUX, UNIX, OS X, WINDOWS,or an embedded operating system such as VxWorks) includes varioussoftware components and/or drivers for controlling and managing generalsystem tasks (e.g., memory management, storage device control, powermanagement, etc.) and facilitates communication between various hardwareand software components.

Communication module 1328 facilitates communication with other devicesover one or more external ports 1324 and also includes various softwarecomponents for handling data received by RF circuitry 1308 and/orexternal port 1324. External port 1324 (e.g., Universal Serial Bus(USB), FIREWIRE, etc.) is adapted for coupling directly to other devicesor indirectly over a network (e.g., the Internet, wireless LAN, etc.).In some embodiments, the external port is a multi-pin (e.g., 30-pin)connector.

Contact/motion module 1330 may detect contact with touch screen 1312 (inconjunction with display controller 1356) and other touch sensitivedevices (e.g., a touchpad or physical click wheel). In some embodiments,contact/motion module 1330 and display controller 1356 detect contact ona touchpad. Contact/motion module 1330 may detect a gesture input by auser. Different gestures on the touch-sensitive surface have differentcontact patterns. Graphics module 1332 includes various known softwarecomponents for rendering and displaying graphics on touch screen 1312 orother display, including components for changing the intensity ofgraphics that are displayed. As used herein, the term “graphics”includes any object that can be displayed to a user, including withoutlimitation text, web pages, icons (such as user-interface objectsincluding soft keys), digital images, videos, animations and the like.Text input module 1334, which may be a component of graphics module1332, provides soft keyboards for entering text in various applications(e.g., contacts, e-mail, and any other application that needs textinput). GPS module 1335 determines the location of the device andprovides this information for use in various applications 1336 (e.g., toa camera application as picture/video metadata).

Applications 1336 may include one or more modules (e.g., a contactsmodule, an email client module, a camera module for still and/or videoimages, etc.) Examples of other applications 1336 that may be stored inmemory 1302 include other word processing applications, other imageediting applications, drawing applications, presentation applications,JAVA-enabled applications, encryption, digital rights management, voicerecognition, and voice replication. Each of the modules and applicationscorrespond to a set of executable instructions for performing one ormore functions described above and the methods described in thisapplication (e.g., the computer-implemented methods and otherinformation processing methods described herein). These modules (i.e.,sets of instructions) need not be implemented as separate softwareprograms, procedures or modules, and thus various subsets of thesemodules may be combined or otherwise re-arranged in various embodiments.In some embodiments, memory 1302 may store a subset of the modules anddata structures identified above. Furthermore, memory 1302 may storeadditional modules and data structures not described above.

FIG. 14 depicts illustrates an example portable multifunction device1300 that may include a camera, in accordance with some embodiments. Insome embodiments, the portable multifunction device 1300 may include oneor multiple features, components, and/or functionality of embodimentsdescribed herein with reference to FIGS. 1A-13 and 15.

The device 1300 may have a touch screen 1312. The touch screen 1312 maydisplay one or more graphics within user interface (UI) 1400. In thisembodiment, as well as others described below, a user may select one ormore of the graphics by making a gesture on the graphics, for example,with one or more fingers 1402 (not drawn to scale in the figure) or oneor more styluses 1403 (not drawn to scale in the figure).

Device 1300 may also include one or more physical buttons, such as“home” or menu button 1404. As described previously, menu button 1404may be used to navigate to any application 1336 in a set of applicationsthat may be executed on device 1300. Alternatively, in some embodiments,the menu button 1404 is implemented as a soft key in a GUI displayed ontouch screen 1312.

In one embodiment, device 1300 includes touch screen 1312, menu button1404, push button 1406 for powering the device on/off and locking thedevice, volume adjustment button(s) 1408, Subscriber Identity Module(SIM) card slot 1410, head set jack 1412, and docking/charging externalport 1324. Push button 1406 may be used to turn the power on/off on thedevice by depressing the button and holding the button in the depressedstate for a predefined time interval; to lock the device by depressingthe button and releasing the button before the predefined time intervalhas elapsed; and/or to unlock the device or initiate an unlock process.In an alternative embodiment, device 1300 also may accept verbal inputfor activation or deactivation of some functions through microphone1313.

It should be noted that, although many of the examples herein are givenwith reference to optical sensor(s)/camera(s) 1364 (on the front of adevice), one or more rear-facing cameras or optical sensors that arepointed opposite from the display may be used instead of, or in additionto, an optical sensor(s)/camera(s) 1364 on the front of a device. Atleast one, several, or all cameras 1364 may include one or multiplefeatures, components, and/or functionality of embodiments describedherein with reference to FIGS. 1A-12D, 13, and 15

FIG. 15 illustrates an example computer system 1500 that may include oneor more cameras, in accordance with some embodiments. At least one,several, or all cameras of computer system 1500 may include one ormultiple features, components, and/or functionality of embodimentsdescribed herein with reference to FIGS. 1A-14. In some embodiments, thecomputer system 1500 may include one or multiple features, components,and/or functionality of embodiments described herein with reference toFIGS. 1A-14.

The computer system 1500 may be configured to execute any or all of theembodiments described above. In different embodiments, computer system1500 may be any of various types of devices, including, but not limitedto, a personal computer system, desktop computer, laptop, notebook,tablet, slate, pad, or netbook computer, mainframe computer system,handheld computer, workstation, network computer, a camera, a set topbox, a mobile device, a consumer device, video game console, handheldvideo game device, application server, storage device, a television, avideo recording device, a peripheral device such as a switch, modem,router, or in general any type of computing or electronic device.

Various embodiments of a camera motion control system as describedherein, including embodiments of magnetic position sensing, as describedherein may be executed in one or more computer systems 1500, which mayinteract with various other devices. Note that any component, action, orfunctionality described above with respect to FIGS. 1-14 may beimplemented on one or more computers configured as computer system 1500of FIG. 15, according to various embodiments. In the illustratedembodiment, computer system 1500 includes one or more processors 1510coupled to a system memory 1520 via an input/output (I/O) interface1530. Computer system 1500 further includes a network interface 1540coupled to I/O interface 1530, and one or more input/output devices1550, such as cursor control device 1560, keyboard 1570, and display(s)1580. In some cases, it is contemplated that embodiments may beimplemented using a single instance of computer system 1500, while inother embodiments multiple such systems, or multiple nodes making upcomputer system 1500, may be configured to host different portions orinstances of embodiments. For example, in one embodiment some elementsmay be implemented via one or more nodes of computer system 1500 thatare distinct from those nodes implementing other elements.

In various embodiments, computer system 1500 may be a uniprocessorsystem including one processor 1510, or a multiprocessor systemincluding several processors 1510 (e.g., two, four, eight, or anothersuitable number). Processors 1510 may be any suitable processor capableof executing instructions. For example, in various embodimentsprocessors 1510 may be general-purpose or embedded processorsimplementing any of a variety of instruction set architectures (ISAs),such as the x86, PowerPC, SPARC, or MIPS ISAs, or any other suitableISA. In multiprocessor systems, each of processors 1510 may commonly,but not necessarily, implement the same ISA.

System memory 1520 may be configured to store camera control programinstructions 1522 and/or camera control data accessible by processor1510. In various embodiments, system memory 1520 may be implementedusing any suitable memory technology, such as static random accessmemory (SRAM), synchronous dynamic RAM (SDRAM), nonvolatile/Flash-typememory, or any other type of memory. In the illustrated embodiment,program instructions 1522 may be configured to implement a lens controlapplication 1524 incorporating any of the functionality described above.Additionally, existing camera control data 1532 of memory 1520 mayinclude any of the information or data structures described above. Insome embodiments, program instructions and/or data may be received, sentor stored upon different types of computer-accessible media or onsimilar media separate from system memory 1520 or computer system 1500.While computer system 1500 is described as implementing thefunctionality of functional blocks of previous Figures, any of thefunctionality described herein may be implemented via such a computersystem.

In one embodiment, I/O interface 1530 may be configured to coordinateI/O traffic between processor 1510, system memory 1520, and anyperipheral devices in the device, including network interface 1540 orother peripheral interfaces, such as input/output devices 1550. In someembodiments, I/O interface 1530 may perform any necessary protocol,timing or other data transformations to convert data signals from onecomponent (e.g., system memory 1520) into a format suitable for use byanother component (e.g., processor 1510). In some embodiments, I/Ointerface 1530 may include support for devices attached through varioustypes of peripheral buses, such as a variant of the Peripheral ComponentInterconnect (PCI) bus standard or the Universal Serial Bus (USB)standard, for example. In some embodiments, the function of I/Ointerface 1530 may be split into two or more separate components, suchas a north bridge and a south bridge, for example. Also, in someembodiments some or all of the functionality of I/O interface 1530, suchas an interface to system memory 1520, may be incorporated directly intoprocessor 1510.

Network interface 1540 may be configured to allow data to be exchangedbetween computer system 1500 and other devices attached to a network1585 (e.g., carrier or agent devices) or between nodes of computersystem 1500. Network 1585 may in various embodiments include one or morenetworks including but not limited to Local Area Networks (LANs) (e.g.,an Ethernet or corporate network), Wide Area Networks (WANs) (e.g., theInternet), wireless data networks, some other electronic data network,or some combination thereof. In various embodiments, network interface1540 may support communication via wired or wireless general datanetworks, such as any suitable type of Ethernet network, for example;via telecommunications/telephony networks such as analog voice networksor digital fiber communications networks; via storage area networks suchas Fibre Channel SANs, or via any other suitable type of network and/orprotocol.

Input/output devices 1550 may, in some embodiments, include one or moredisplay terminals, keyboards, keypads, touchpads, scanning devices,voice or optical recognition devices, or any other devices suitable forentering or accessing data by one or more computer systems 1500.Multiple input/output devices 1550 may be present in computer system1500 or may be distributed on various nodes of computer system 1500. Insome embodiments, similar input/output devices may be separate fromcomputer system 1500 and may interact with one or more nodes of computersystem 1500 through a wired or wireless connection, such as over networkinterface 1540.

As shown in FIG. 15, memory 1520 may include program instructions 1522,which may be processor-executable to implement any element or actiondescribed above. In one embodiment, the program instructions mayimplement the methods described above. In other embodiments, differentelements and data may be included. Note that data may include any dataor information described above.

Those skilled in the art will appreciate that computer system 1500 ismerely illustrative and is not intended to limit the scope ofembodiments. In particular, the computer system and devices may includeany combination of hardware or software that can perform the indicatedfunctions, including computers, network devices, Internet appliances,PDAs, wireless phones, pagers, etc. Computer system 1500 may also beconnected to other devices that are not illustrated, or instead mayoperate as a stand-alone system. In addition, the functionality providedby the illustrated components may in some embodiments be combined infewer components or distributed in additional components. Similarly, insome embodiments, the functionality of some of the illustratedcomponents may not be provided and/or other additional functionality maybe available.

Those skilled in the art will also appreciate that, while various itemsare illustrated as being stored in memory or on storage while beingused, these items or portions of them may be transferred between memoryand other storage devices for purposes of memory management and dataintegrity. Alternatively, in other embodiments some or all of thesoftware components may execute in memory on another device andcommunicate with the illustrated computer system via inter-computercommunication. Some or all of the system components or data structuresmay also be stored (e.g., as instructions or structured data) on acomputer-accessible medium or a portable article to be read by anappropriate drive, various examples of which are described above. Insome embodiments, instructions stored on a computer-accessible mediumseparate from computer system 1500 may be transmitted to computer system1500 via transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as a network and/or a wireless link. Various embodiments mayfurther include receiving, sending or storing instructions and/or dataimplemented in accordance with the foregoing description upon acomputer-accessible medium. Generally speaking, a computer-accessiblemedium may include a non-transitory, computer-readable storage medium ormemory medium such as magnetic or optical media, e.g., disk orDVD/CD-ROM, volatile or non-volatile media such as RAM (e.g. SDRAM, DDR,RDRAM, SRAM, etc.), ROM, etc. In some embodiments, a computer-accessiblemedium may include transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as network and/or a wireless link.

The following clauses further describe various embodiments that mayinclude various features as described above and/or illustrated in theFigures:

Clause 1. A coil structure, comprising:

-   -   a base portion that includes an autofocus (AF) coil to provide        AF to a camera; and    -   tab portions that extend from the base portion, wherein each of        the tab portions includes:        -   a respective optical image stabilization (OIS) coil to            provide OIS to the camera; and        -   a respective fold portion between the base portion and the            respective OIS coil, wherein the coil structure is folded at            the respective fold portion to orient the respective OIS            coil at an angle relative to the AF coil.            Clause 2. The coil structure of clause 1, wherein:    -   the AF coil defines a first plane;    -   the respective OIS coil defines a second plane; and    -   the first plane is orthogonal to the second plane.        Clause 3. The coil structure of clause 1, wherein the AF coil is        sized to surround an image sensor of the camera.        Clause 4. The coil structure of clause 1, wherein coil structure        is formed of a flex circuit.        Clause 5. The coil structure of clause 1, further comprising:    -   a substrate;    -   wherein the AF coil and the respective OIS coil are formed on        the substrate via an additive deposition process.        Clause 6. A voice coil motor (VCM) actuator to shift an image        sensor of a camera along multiple axis, the VCM actuator        comprising:    -   a magnet;    -   a plurality of coils;    -   a substrate to couple with an image sensor of a camera such that        the image sensor moves together with the substrate;    -   a top flexure to guide motion of the substrate in a controlled        manner, wherein the top flexure comprises:        -   a leaf portion; and        -   a wire portion, comprising:            -   a top end attached to the leaf portion; and            -   a bottom end attached to a first stationary component of                the camera.                Clause 7. The VCM actuator of clause 6, further                comprising:    -   a bottom flexure to guide motion of the substrate in a        controlled manner;    -   wherein the bottom flexure comprises:        -   a movable platform attached to the substrate;        -   a stationary platform attached to the first stationary            component or a second stationary component of the camera;            and        -   one or more flexure arms that connect the movable platform            to the stationary platform.            Clause 8. The VCM actuator of clause 6, wherein the leaf            portion is formed of an etched sheet.            Clause 9. The VCM actuator of clause 8, wherein the leaf            portion comprises:    -   outer corner portions; and    -   an inner ring portion attached to a movable component of the        camera.        Clause 10. The VCM actuator of clause 9, wherein the top end of        the wire portion is attached to at least one of the outer corner        portions.        Clause 11. The VCM actuator of clause 9, wherein the inner ring        portion is attached to a coil carrier of the camera, and wherein        the coil carrier holds the plurality of coils.        Clause 12. The VCM actuator of clause 6, wherein the magnet and        the plurality of coils are configured to magnetically interact        to:    -   move the image sensor in a plurality of directions orthogonal to        an optical axis of the camera; and    -   move the image sensor along the optical axis.        Clause 13. The VCM actuator of clause 7, wherein:    -   the bottom flexure extends along a first plane that is        orthogonal to an optical axis of the camera;    -   the leaf portion of the top flexure extends along a second plane        that is orthogonal to the optical axis; and    -   the first plane is closer to the image sensor than the second        plane.        Clause 14. The VCM actuator of clause 6, wherein:    -   the plurality of coils include an autofocus (AF) coil and        optical image stabilization (OIS) coils; and    -   the VCM actuator further comprises:        -   a coil structure, including:            -   a base portion that includes the AF coil; and            -   tab portions that extend from the base portion, wherein                each of the tab portions includes:                -   a respective OIS coil of the OIS coils; and            -   a respective fold portion between the base portion and                the respective OIS coil, wherein the coil structure is                folded at the respective fold portion to orient the                respective OIS coil to be orthogonal to the AF coil.                Clause 15. The VCM actuator of clause 14, wherein:    -   the coil structure further comprises a first position sensor        mounting portion and a second position sensor mounting portion;        and    -   the first position sensor mounting portion extends from a first        OIS coil of the OIS coils such that a first position sensor        mounted to the first position sensor mounting portion is capable        of sensing OIS movement in a first direction; and    -   the second position sensor mounting portion extends from a        second OIS coil of the OIS coils such that a second position        sensor mounted to the second position sensor mounting portion is        capable of sensing OIS movement in a second direction that is        orthogonal to the first direction.        Clause 16. A camera, comprising:    -   a lens comprising one or more lens elements;    -   an image sensor configured to capture light passing through the        lens and convert the captured light into image signals;    -   a voice coil motor (VCM) actuator, comprising:        -   magnets; and        -   a coil structure, including:            -   a bottom autofocus (AF) coil to shift the image sensor                along an optical axis of the camera to provide AF,                wherein the bottom AF coil is located below the magnets;                and            -   optical image stabilization (OIS) coils to shift the                image sensor in directions orthogonal to the optical                axis to provide OIS, wherein each of the OIS coils is                located proximate a respective magnet of the magnets,                and wherein the OIS coils are orthogonal to the bottom                AF coil.                Clause 17. The camera of clause 16, wherein:    -   the magnets are stationary; and    -   the coil structure is movable relative to the magnets.        Clause 18. The camera of clause 16, wherein each of the magnets        is a corner magnet that is located proximate a respective corner        of the camera.        Clause 19. The camera of clause 16, wherein each of the magnets        is a side magnet that is located proximate a respective side of        the camera.        Clause 20. The camera of clause 16, further comprising a top AF        coil to shift the image sensor along the optical axis to provide        AF, wherein the top AF coil is located above the magnets.        Clause 21. The camera of clause 16, wherein the bottom AF coil        is sized to form a first periphery that is larger than a second        periphery formed by the image sensor.        Clause 22. The camera of clause 16, wherein the VCM actuator        further comprises:    -   a substrate coupled to the image sensor such that the image        sensor moves together with the substrate; and    -   a top flexure to guide motion of the substrate in a controlled        manner, wherein the top flexure comprises:        -   a leaf portion; and        -   a wire portion, comprising:            -   a top end attached to the leaf portion; and            -   a bottom end attached to a stationary component of the                camera.                Clause 23. The camera of clause 16, wherein the VCM                actuator further comprises:    -   a substrate coupled to the image sensor such that the image        sensor moves together with the substrate; and    -   a bottom flexure to guide motion of the substrate in a        controlled manner;    -   wherein the bottom flexure comprises:        -   a movable platform attached to the substrate;        -   a stationary platform attached to a stationary component of            the camera; and        -   one or more flexure arms that connect the movable platform            to the stationary platform.            Clause 24. The camera of clause 16, wherein the VCM actuator            further includes:    -   a substrate coupled to the image sensor such that the image        sensor moves together with the substrate;    -   a top flexure to guide motion of the substrate in a controlled        manner, wherein the top flexure comprises:        -   a leaf portion; and        -   a wire portion, comprising:            -   a top end attached to the leaf portion; and            -   a bottom end attached to a first stationary component of                the camera; and    -   a bottom flexure to guide motion of the substrate in a        controlled manner, wherein the bottom flexure comprises:        -   a movable platform attached to the substrate;        -   a stationary platform attached to the first stationary            component or a second stationary component of the camera;            and        -   one or more flexure arms that connect the movable platform            to the stationary platform.            Clause 25. The camera of clause 16, wherein:    -   the magnets include four magnets;    -   the OIS coils include four OIS coils; and    -   each of the four OIS coils is located proximate a respective one        of the four OIS coils.        Clause 26. The camera of clause 16, further comprising:    -   a coil carrier to hold the coil structure;    -   wherein:        -   the coil carrier includes at least two windows; and        -   each of the at least two windows is sized to accommodate at            least a portion of a respective position sensor of the            camera.            Clause 27. The camera of clause 16, further comprising:    -   a first position sensor disposed proximate a first OIS coil of        the OIS coils; and    -   a second position sensor disposed proximate a second OIS coil of        the OIS coils.        Clause 28. The camera of clause 27, wherein:    -   the first OIS coil is part of a first pair of opposing OIS coils        that contribute to OIS movement in a first direction;    -   the first position sensor is positioned to sense the OIS        movement in the first direction;    -   the second OIS coil is part of a second pair of opposing OIS        coils that contribute to OIS movement in a second direction that        is orthogonal to the first direction; and    -   the second position sensor is positioned to sense the OIS        movement in the second direction.        Clause 29. The camera of clause 28, wherein the first position        sensor and the second position sensor are positioned to sense AF        movement.        Clause 30. The camera of clause 27, wherein the first position        sensor is a Hall sensor, a GMR sensor, or a TMR sensor.        Clause 31. A mobile device, comprising:    -   a camera module, including:        -   a lens comprising one or more lens elements;        -   an image sensor configured to capture light passing through            the lens and covert the captured light into image signals;        -   magnets;        -   an autofocus (AF) coil that magnetically interacts with the            magnets to shift the image sensor along an optical axis of            the camera module; and        -   optical image stabilization (OIS) coils that magnetically            interact with the magnets to shift the image sensor in            directions orthogonal to the optical axis;        -   a first position sensor located proximate a first magnet of            the magnets, wherein the first position sensor is positioned            to sense at least one of:            -   OIS movement based on a first magnetic field component                produced by the first magnet in a first direction that                is orthogonal to the optical axis; or            -   AF movement based on the first magnetic field component                and a second magnetic field component produced by the                first magnet in a second direction that is orthogonal to                the first direction;    -   a display; and    -   one or more processors configured to:        -   determine a first position of the image sensor based at            least in part on at least one of the OIS movement or the AF            movement sensed by the first position sensor;        -   cause the VCM actuator to move the image sensor, relative to            an optical axis of the camera module, to a second position;            and        -   cause the camera module to capture an image while the image            sensor is at the second position; and        -   cause the display to present the image.            Clause 32. The mobile device of clause 31, wherein the            camera module further comprises:    -   a second position sensor located proximate a second magnet of        the magnets, wherein the second position sensor is positioned to        sense at least one of:        -   OIS movement based on a third magnetic field component            produced by the second magnet in a third direction that is            orthogonal to the optical axis and the first direction; or        -   AF movement based on the third magnetic field component and            a fourth magnetic field component produced by the second            magnet in a fourth direction that is orthogonal to the third            direction.

The methods described herein may be implemented in software, hardware,or a combination thereof, in different embodiments. In addition, theorder of the blocks of the methods may be changed, and various elementsmay be added, reordered, combined, omitted, modified, etc. Variousmodifications and changes may be made as would be obvious to a personskilled in the art having the benefit of this disclosure. The variousembodiments described herein are meant to be illustrative and notlimiting. Many variations, modifications, additions, and improvementsare possible. Accordingly, plural instances may be provided forcomponents described herein as a single instance. Boundaries betweenvarious components, operations and data stores are somewhat arbitrary,and particular operations are illustrated in the context of specificillustrative configurations. Other allocations of functionality areenvisioned and may fall within the scope of claims that follow. Finally,structures and functionality presented as discrete components in theexample configurations may be implemented as a combined structure orcomponent. These and other variations, modifications, additions, andimprovements may fall within the scope of embodiments as defined in theclaims that follow.

What is claimed is:
 1. A camera, comprising: a lens comprising one ormore lens elements; an image sensor configured to capture light passingthrough the lens and convert the captured light into image signals; avoice coil motor (VCM) actuator, comprising: magnets; and a coilstructure, including: an autofocus (AF) coil to shift the image sensoralong an optical axis of the camera to provide AF, wherein the AF coilis located below, above, or both below and above the magnets; andoptical image stabilization (OIS) coils to shift the image sensor indirections orthogonal to the optical axis to provide OIS, wherein eachof the OIS coils is located proximate a respective magnet of themagnets, and wherein the OIS coils are orthogonal to the AF coil; and aflexure arrangement to guide motion of the coil structure and imagesensor in a controlled manner, wherein the flexure comprises: a leafportion attached to the coil structure; and a wire portion extendingfrom the leaf portion to a stationary component of the camera.
 2. Thecamera of claim 1, wherein: the magnets are stationary; and the coilstructure is movable relative to the magnets.
 3. The camera of claim 1,wherein each of the magnets is a corner magnet that is located proximatea respective corner of the camera.
 4. The camera of claim 1, whereineach of the magnets is a side magnet that is located proximate arespective side of the camera.
 5. The camera of claim 1, wherein the AFcoil is located below the magnets, the camera further comprising a topAF coil to assist in shifting the image sensor along the optical axis toprovide AF, wherein the top AF coil is located above the magnets.
 6. Thecamera of claim 1, wherein the AF coil is sized to form a firstperiphery that is larger than a second periphery formed by the imagesensor.
 7. The camera of claim 1, wherein the VCM actuator furthercomprises: a substrate coupled to the coil structure and to the imagesensor such that the image sensor moves together with the substrate. 8.The camera of claim 7, wherein the flexure arrangement furthercomprises: a bottom flexure to guide motion of the substrate in acontrolled manner; wherein the bottom flexure comprises: a movableplatform attached to the substrate; a stationary platform attached to astationary component of the camera; and one or more flexure arms thatconnect the movable platform to the stationary platform.
 9. The cameraof claim 8, wherein the flexure arrangement further comprising a topflexure including the leaf portion and the wire portion, wherein theleaf portion extends above the bottom flexure to assist in suspendingand guiding the substrate.
 10. The camera of claim 9, wherein: thebottom flexure extends along a first plane that is orthogonal to anoptical axis of the camera; the leaf portion of the top flexure extendsalong a second plane that is orthogonal to the optical axis; and thefirst plane is closer to the image sensor than the second plane.
 11. Thecamera of claim 1, wherein: the magnets include four magnets; the OIScoils include four OIS coils; and each of the four OIS coils is locatedproximate a respective one of the four magnets.
 12. The camera of claim1, further comprising: a coil carrier to hold the coil structure;wherein: the coil carrier includes at least two windows; and each of theat least two windows is sized to accommodate at least a portion of arespective position sensor of the camera.
 13. The camera of claim 1,further comprising: a first position sensor disposed proximate a firstOIS coil of the OIS coils; and a second position sensor disposedproximate a second OIS coil of the OIS coils.
 14. The camera of claim13, wherein: the first OIS coil is part of a first pair of opposing OIScoils that contribute to OIS movement in a first direction; the firstposition sensor is positioned to sense the OIS movement in the firstdirection; the second OIS coil is part of a second pair of opposing OIScoils that contribute to OIS movement in a second direction that isorthogonal to the first direction; and the second position sensor ispositioned to sense the OIS movement in the second direction.
 15. Thecamera of claim 14, wherein the first position sensor and the secondposition sensor are positioned to sense AF movement.
 16. The camera ofclaim 13, wherein the first position sensor is a Hall sensor, a GMRsensor, or a TMR sensor.
 17. The camera of claim 1, wherein the coilstructure comprises: a base portion that includes the autofocus (AF)coil; and tab portions that extend from the base portion, wherein eachof the tab portions includes: a respective optical image stabilization(OIS) coil of the OIS coils; and a respective fold portion between thebase portion and the respective OIS coil, wherein the coil structure isfolded at the respective fold portion to orient the respective OIS coilat an angle relative to the AF coil.
 18. The camera of claim 1, whereinthe AF coil is sized to surround the image sensor of the camera.
 19. Thecamera of claim 1, wherein coil structure is formed of a flex circuit.20. The camera of claim 1, wherein the AF coil and the respective OIScoil are formed on a coil structure substrate via an additive depositionprocess.